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PSA FM31X104K451EEG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM31X104K451EEG
- Type
- PSA
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM31X104K451EEG
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.07g
- Electronic Component
- 1
- Electronic Component
- BM0264906409
- Electronic Component
- X7R
- Voltage
- 450V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM31X104K451EEG 产品概述
一、产品简介
FM31X104K451EEG 为贴片多层陶瓷电容（MLCC），标称容量 100nF（0.1µF），公差 ±10%，额定工作电压 450V，温度特性 X7R，封装为 1206（3.2mm × 1.6mm）。该器件由 PSA（信昌电陶）提供，适合高压直流和交流场合下的旁路、滤波与能量缓冲需求。
二、主要参数
- 容值：100nF（0.1µF）
- 精度：±10%
- 额定电压：450V DC（在交流或脉冲环境下需根据实际应力校核）
- 温度特性：X7R（-55°C 至 +125°C，温度范围内容量变化在一定范围内可接受）
- 封装：1206（符合常规 SMT 工艺）
- 类型：多层陶瓷贴片电容（MLCC）
三、性能特点
- 高电压耐受：450V 额定电压可满足中高压电源、整流滤波与电机驱动等应用需求。
- 稳定的温度特性：X7R 在宽温区间内保持较稳定的介电常数，适合一般工业级应用。
- 小体积大容量：1206 封装在占板面积有限的情况下提供 0.1µF 容量，利于 PCB 布局密集化。
- 低等效串联电阻与电感（ESR/ESL）特性良好，有利于高频旁路和瞬态抑制。
四、使用注意事项
- 直流偏压效应：X7R 等高介电常数陶瓷在加高电压时会产生显著的容量下降，实际工作电压下的有效容量应在设计时预估并验证。
- 温度与应力影响：陶瓷电容对机械应力（如过度弯曲、强力回流焊后冷却等）较敏感，板上封装引脚附近需注意焊盘设计与应力释放。
- 老化与湿热：陶瓷电容会有电容量随时间缓慢变化的老化现象，遇潮湿、高温环境时性能可能受影响，封装与存储条件需符合厂商推荐。
- 回流焊与可靠性：遵循厂商提供的回流焊温度曲线与推荐工艺以保证焊接可靠性。
五、典型应用场景
- 开关电源的输入/输出滤波与旁路；
- 中高压直流链路的去耦与能量缓冲；
- 电机驱动与逆变器系统中的 EMI 抑制与吸收网络；
- 高压测量电路、整流滤波、高频脉冲电路的局部补偿。
六、选型与建议
在选型时，建议结合实际工作电压、温度范围和电压降额需求综合评估：对于要求稳定容量的高压场合，需考虑 DC-bias 导致的有效容量下降，必要时可以选择更大标称容值或更适合的介质体系（如 C0G/NP0）用于精密滤波；对于一般工业去耦与旁路，FM31X104K451EEG 在体积与性能之间提供良好平衡。最后，参考 PSA（信昌电陶）提供的完整技术资料与应用手册，按推荐的 PCB 布局与回流焊工艺进行实现，可获得最佳长期可靠性。
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