WMSIC Electronic Components

PSA FV43X103K202EGG

ModelFV43X103K202EGG
Package1812
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV43X103K202EGG
Type
PSA
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV43X103K202EGG
Electronic Component
1
Electronic Component
10nF
Package
1812
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.237g
Electronic Component
1
Electronic Component
BM0264820196
Electronic Component
X7R
Voltage
2kV
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV43X103K202EGG 产品概述

一、产品简介

FV43X103K202EGG 为 PSA(信昌电陶)出品的一款高压贴片多层陶瓷电容(MLCC),标称电容值 10nF,公差 ±10%(K),额定电压 2kV,介质类型 X7R,封装尺寸 1812(大约 4.6mm × 3.2mm)。此器件针对高压滤波、耦合、旁路和脉冲应用进行了优化,兼顾体积与耐压能力,适合要求空间有限但电压要求高的场合。

二、主要参数

  • 型号:FV43X103K202EGG
  • 品牌:PSA(信昌电陶)
  • 电容值:10nF (103)
  • 公差:±10% (K)
  • 额定电压:2 kV(直流)
  • 介质:X7R(-55°C 至 +125°C,温度范围内电容变化上限约 ±15%)
  • 封装:1812(约 4.6 × 3.2 mm)
  • 封装形式:贴片(SMT)

三、性能特点

  • 高耐压:2kV 额定电压,适合中高压应用场景。
  • 温度特性稳定:X7R 介质在宽温区间内保持较小的温度系数,适用于对温度依赖性有一定容忍度但需稳定性的电路。
  • 尺寸与容量平衡:1812 封装在保持 10nF 电容量的同时,便于 SMT 自动化贴装与焊接。
  • 可靠性:多层陶瓷结构,具备良好的机械强度与长期可靠性,适合工业级应用。

四、典型应用

  • 高压滤波与去耦(电源供电端、高压模块)
  • 高频耦合与旁路(脉冲电路、探测器前端)
  • 脉冲整形与钳位(高压开关、驱动电路)
  • 通信、医疗和工业仪器中的高压电路

五、使用与焊接注意事项

  • DC Bias 与温漂:X7R 介质在施加高直流电压时电容值会出现衰减,设计时应予以评估并留有裕量。
  • 电压裕量:建议在设计时保留安全裕度(视关键性一般建议 ≤80% 额定电压工作,关键应用可更保守)。
  • 回流焊:遵循 IPC/JEDEC 回流焊温度曲线,避免超过制造商推荐的峰值温度与时间,以防裂纹或性能退化。
  • 机械应力:在焊接与装配时防止过大的弯曲或拉伸,应优化焊盘与过孔设计以减少热机械应力。
  • 贮存与处理:避免潮湿与剧烈温度循环,贴片应按制造商建议保管与使用期限内贴装。

六、选型与替代建议

若电路对温度系数或偏差更苛刻,可考虑温度特性更好的介质或更高容差等级的器件;若需更小体积且接受更低额定电压,可选小封装型号;相近参数的同类高压 MLCC 可作为替代,但需比对 DC bias、老化特性与机械尺寸。

七、规格与采购

  • 标配为 SMT 卷带包装(具体包装方式与数量以供货商报价为准)。
  • 下单时请注明型号 FV43X103K202EGG、批号与封装要求,必要时索取产品数据手册(Datasheet)与可靠性测试报告,以便验证温漂、DC bias 与焊接规范。

如需我帮您把该型号的典型曲线(温度特性、DC bias 曲线)、封装图或替代型号列表整理为表格或图示,可告知具体需求与使用工况。

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