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PSA FS18X105K500PBG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FS18X105K500PBG
- Type
- PSA
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FS18X105K500PBG
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0264820255
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FS18X105K500PBG 贴片陶瓷电容（MLCC）产品概述
一、产品核心规格参数
FS18X105K500PBG为PSA信昌电陶出品的通用型多层陶瓷贴片电容（MLCC），核心参数适配多数电子电路的基础需求，具体如下：
- 容值：1μF（编码“105”对应10×10⁵pF）；
- 精度：±10%（标识“K”），满足非高精度电路的匹配要求；
- 额定电压：50V（标识“500”），覆盖低压至中压应用场景；
- 温度系数：X7R，工作温度范围**-55℃~125℃**，容值变化率≤±15%（行业标准）；
- 封装：0603（英制尺寸，公制1608，即1.6mm×0.8mm），体积紧凑；
- 环保标准：符合RoHS 2.0、REACH法规，无铅无卤。
二、关键特性解析
该产品围绕“稳定性、小型化、通用性”设计，核心特性如下：
- 温度稳定性优异：X7R介质材料避免了Y5V等材料高温下容值骤降的问题，宽温环境下性能稳定；
- 小型化适配：0603封装可显著压缩PCB布局空间，满足消费电子“轻薄化”需求；
- 高频低损：MLCC无极性、寄生电感低，适合信号耦合、滤波等高频电路，减少信号损耗；
- 工艺可靠性：PSA成熟生产工艺支持回流焊/波峰焊，抗机械应力能力强，长期工作故障率低。
三、典型应用场景
因参数均衡，FS18X105K500PBG广泛应用于以下领域：
- 消费电子：智能手机电源滤波、智能穿戴传感器耦合；
- 工业控制：小型PLC输入输出滤波、工业传感器信号处理；
- 通信设备：路由器电源模块、无线基站射频辅助电路；
- 家电产品：智能电视电源电路、空调控制板滤波；
- 车载辅助系统：行车记录仪、车载音响的低功耗电路（适配常规车载温度）。
四、品牌与可靠性保障
PSA信昌电陶是国内被动元件核心供应商，专注MLCC研发超20年，产品覆盖多封装多容值。FS18X105K500PBG具备：
- 符合ISO 9001体系，每批次经容值、耐压、温度测试；
- 高温老化1000小时后容值衰减≤5%（行业标准）；
- 抗开裂性能优异，适配常规贴片工艺。
五、选型适配注意事项
为确保性能稳定，选型需注意：
- 电压降额：实际工作电压≤40V（额定电压80%），避免过压衰减；
- 温度范围：若环境温度超125℃，需更换X8R等高温介质；
- 精度需求：高精度电路（如振荡器）需选±5%（J级）或更高精度；
- 焊盘兼容：0603封装需符合IPC-7351标准，避免焊接不良。
该产品以“高性价比+通用适配”为核心优势，是电子设备基础电路的优选被动元件。
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