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PSA FM32X104K631EFG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM32X104K631EFG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM32X104K631EFG
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.134g
- Electronic Component
- 1
- Electronic Component
- BM0264744202
- Electronic Component
- X7R
- Voltage
- 630V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM32X104K631EFG 产品概述
一、产品简介
FM32X104K631EFG 是 PSA（信昌电陶）推出的一款贴片多层陶瓷电容（MLCC），规格为 100nF (0.1µF)，初始容差 ±10%（K），额定电压 630V DC，介质类型 X7R，常用封装 1210（约 3.2mm × 2.5mm）。该产品面向需要高工作电压与较大电容量密度的电源与滤波应用，兼顾体积与耐压性能。
二、主要电气参数
- 容值：100nF（0.1µF）
- 初始容差：±10%（K）
- 额定电压：630V DC
- 介质：X7R（-55°C 至 +125°C，温度下限/上限）
- 温度特性：X7R 在全温区内容值变化通常在 ±15% 范围（实际以厂家数据为准）
- 封装：1210（SMD）
三、性能特点
- 高耐压：630V 额定电压适合中高压直流回路、开关电源高压侧滤波与抑制浪涌。
- 容量密度高：X7R 介质在相同体积下能提供比 NP0/C0G 更大的容值，适合体积受限场合。
- 低等效串联电阻（ESR）和良好高频特性，有利于去耦与 EMI 抑制。
- 工艺稳定，适用于标准回流焊工艺（请参照厂商回流曲线）。
四、典型应用
- 中高压开关电源 DC-link 或旁路电容
- 开关器件吸收/缓冲电容（snubber、能量缓冲）
- LED 驱动、工业照明电源、变频驱动器的滤波与去耦
- EMI 抑制网络与高压耦合电路
五、选型与使用注意事项
- DC 偏置效应：多层陶瓷在高直流偏压下容量会下降，且下降程度与尺寸、介质配方相关；实际使用时建议参考厂家 DC-bias 曲线并留裕量。
- 温度与频率特性：X7R 为高介电常数介质，温度与频率会影响容量与损耗，精密电路请评估温度稳定性或考虑使用 C0G/NP0。
- 机械应力敏感：贴片陶瓷电容对 PCB 弯曲与焊接应力敏感，合理的焊盘设计和应力缓冲可以降低裂纹风险。
- 工作裕量：在高可靠性或长寿命场景，建议不在最高额定电压长期满载工作。
六、封装与焊接建议
- 1210 尺寸适配常见贴装设备，推荐按照 PSA 提供的 PCB land pattern 与回流曲线进行焊接。
- 储存与处理需防潮、防机械冲击，贴片在焊接后应避免 PCB 弯曲或强振动。
总结：FM32X104K631EFG（PSA）以其 630V 高压额定与 100nF 容量特性，适合中高压电源滤波、去耦和吸收场合。选型时应综合考虑 DC-bias、温度特性和机械应力，参考厂商详尽数据以获得最佳可靠性与性能表现。
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