WMSIC Electronic Components

PSA FN15N102J500PNG

ModelFN15N102J500PNG
Package0402
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 157560

Availability on request

Technical data

Product details

16 specifications

Core information

Product name
PSA FN15N102J500PNG
Type
PSA
Minimum package
10000

Technical parameters

Electronic Component
PSA
Electronic Component
FN15N102J500PNG
Electronic Component
1
Electronic Component
1nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0266034630
Electronic Component
C0G
Voltage
50V
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FN15N102J500PNG 贴片多层陶瓷电容(MLCC)产品概述

FN15N102J500PNG是PSA信昌电陶推出的一款高频高性能贴片多层陶瓷电容(MLCC),属于Class I型C0G(NP0)温度系数系列,针对低损耗、高容值稳定性需求设计,广泛适配消费电子、通信、工业控制等领域的小型化电路。

一、产品核心身份与品牌背景

1. 品牌背书

PSA信昌电陶是国内专注陶瓷电容研发与生产的专业厂商,拥有成熟的多层陶瓷电容(MLCC)制造工艺,产品覆盖Class I(温度稳定型)、Class II(高容值型)等系列,通过ISO 9001、ISO 14001等体系认证,部分产品满足AEC-Q200汽车级标准,可靠性获行业认可。

2. 型号定义解析

型号中各字符对应核心参数:

  • FN15:产品系列标识(高频稳定型MLCC);
  • N102:容值标识,102=10×10² pF=1nF(标称容值);
  • J:精度等级,对应**±5%**(J级为常规精度,满足多数电路需求);
  • 500:额定电压,500=50V DC(直流额定电压,需注意交流电压需降额使用);
  • PNG:封装与包装标识(0402封装,卷带包装)。

二、关键技术参数详解

FN15N102J500PNG的核心参数聚焦“稳定、低损、小型”,具体如下:

参数项 规格值 说明 标称容值 1nF(102) 1000 pF 容值精度 ±5%(J级) 符合IEC 60384-1精度标准 额定电压 50V DC 工作电压需≤额定值,交流场景降额使用 温度系数 C0G(NP0) Class I型,温度系数≤±30ppm/℃ 损耗角正切(DF) ≤0.15%(1kHz,25℃) 低损耗,适合高频信号传输 工作温度范围 -55℃ ~ +125℃ 宽温稳定,适配极端环境应用 封装尺寸 0402(英制) 公制1005(1.0mm×0.5mm),小型化设计

三、材料特性与性能优势

1. C0G介质的核心优势

FN15N102J500PNG采用C0G(NP0)陶瓷介质(钛酸锶基),属于Class I型MLCC,核心优势在于:

  • 温度稳定性:容值随温度变化极小(≤±0.03%/℃),无老化漂移;
  • 低损耗:DF值低,高频下能量损耗少,Q值(品质因数)高;
  • 无极性:可双向使用,电路设计更灵活。

2. 封装与工艺优势

  • 0402小型封装:适配智能手机、智能穿戴等小型化设备的高密度贴装;
  • 端电极设计:采用镍/锡镀层(无铅),焊接可靠性高,符合RoHS 2.0环保标准;
  • 多层印刷工艺:介质层均匀,容值一致性好,批量生产稳定性高。

四、典型应用场景

FN15N102J500PNG的低损、稳定特性使其成为高频与高精度电路的理想选择,典型应用包括:

  • 通信设备:蓝牙模块、WiFi模块、5G基站的信号滤波、耦合电容;
  • 振荡电路:晶体振荡器(XO)、压控振荡器(VCO)的谐振电容,保证频率稳定;
  • 消费电子:智能手机、平板电脑的电源去耦、射频匹配电容;
  • 工业控制:PLC、传感器电路的高精度滤波电容,适配宽温环境;
  • 汽车电子:车载通信模块(如蓝牙、GPS)的辅助电容(若满足AEC-Q200)。

五、可靠性与品质保障

PSA对该产品的可靠性测试覆盖全生命周期:

  • 焊接可靠性:耐焊接热(260℃±5℃,10s),无开裂、剥离;
  • 温度循环:-55℃~+125℃循环1000次,容值变化≤±1%;
  • 湿度耐久性:85℃/85%RH环境下1000h,性能无明显衰减;
  • 出厂检验:全检容值、DF、耐压等关键参数,合格率100%。

六、使用注意事项

  1. 电压降额:交流电路中,额定电压需乘以降额系数(通常≤0.7),避免击穿;
  2. 贴装工艺:0402封装需使用高精度贴片机,焊接温度遵循MLCC标准曲线(避免过热损坏介质层);
  3. 存储要求:未开封产品存储于15℃35℃、湿度40%60%环境,开封后12个月内使用(防止端电极氧化);
  4. 静电防护:MLCC为静电敏感元件,操作需佩戴防静电手环/手套。

总结

FN15N102J500PNG作为PSA信昌电陶的高频稳定型MLCC,凭借C0G介质的温度稳定性、低损耗特性,以及0402封装的小型化优势,成为消费电子、通信、工业等领域的高性价比选择,兼顾可靠性与环保性,满足多样化电路设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.