WMSIC Electronic Components

PUYA P25D40SH-SSH-IR P25D40SH

ModelP25D40SH-SSH-IR
PackageSOP-8-150mil
BrandPUYA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PUYA P25D40SH-SSH-IR
Type
PUYA
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PUYA
Electronic Component
P25D40SH-SSH-IR
Electronic Component
1
Package
SOP-8-150mil
Electronic Component
NOR FLASH
Electronic Component
1g
Electronic Component
1
Features
positions
Electronic Component
BM0264770774
Electronic Component
4Mbit
Operating Temperature
40℃~+85℃
Operating Voltage
2.3V~3.6V
Current
10uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

P25D40SH-SSH-IR 产品概述

一、产品简介

P25D40SH-SSH-IR 是 PUYA(普冉)推出的一款 4Mbit 串行闪存(SPI NOR Flash)器件,专为各类高容量消费类与嵌入式应用设计。器件支持通过 SPI 接口快速读写,常见应用场景为程序代码从闪存复制到嵌入式或外部 RAM 后执行(Code Copy 到 RAM),同时其灵活的擦除架构和优化的块大小也非常适合数据存储需求,避免额外外置存储器。

二、主要特性

  • 接口类型:标准 SPI(最高工作频率 fc = 104 MHz),兼容主流 MCU/MPU 外设
  • 存储容量:4 Mbit(512 KByte)
  • 工作电压:2.3 V ~ 3.6 V,适用 3.3V 与部分 2.7V 系统
  • 低功耗:待机电流典型值 10 μA
  • 擦写寿命:100,000 次(典型)
  • 数据保持(TDR):20 年
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 防护与可靠性功能:硬件写保护(WP#);写使能锁存(WEL);软件写保护(软件 BP);上电复位(POR)

三、规格参数概览

  • 页写入时间(Tpp):约 3 ms(典型)
  • 单次写周期时间(Tw):约 12 ms(典型)
  • 块擦除时间(tBE):约 30 ms(典型)
  • 支持页面编程、扇区/块擦除与整片擦除操作
  • 串行指令集支持常规 Read / Fast Read / Page Program / Sector Erase / Block Erase / Chip Erase / Write Enable / Write Disable 等

四、存储组织与操作特性

器件采用分层擦除架构,擦除块大小经过优化以兼顾代码存储与数据存储效率;页面写入粒度适合小量数据更新而无需整块擦除,从而提高可用空间利用率。典型使用流程为:通过 SPI 发送写使能(WREN)→ 页面编程(Page Program)→ 查询 BUSY 状态直到完成;擦除时建议按块/扇区对齐以获得最佳性能与寿命。

五、可靠性与工作环境

P25D40SH 提供工业级工作温度(-40 ℃ 至 +85 ℃)与较长的数据保持时间(20 年),并具有高达 100k 次的擦写耐久性,适合长期部署的嵌入式系统。硬件与软件写保护机制能够防止误写、上电复位确保上电态可靠性。

六、典型应用

  • 消费类电子:智能家电、机顶盒、数码相框
  • 嵌入式系统:工业控制器、网关、路由器固件存储
  • 可执行代码存储(Code Copy 到 RAM)、配置与日志数据保存
  • 需要低功耗待机与高可靠性的便携设备

七、封装信息与选型提示

  • 封装:SOP-8 (150 mil) 方便 DIP/SMD 两种组装方式的适配
  • 选型建议:在高频读取场景下注意 PCB 的 SPI 信号完整性与上拉/下拉配置;若需要更高的容量或 XIP(Execute In Place)直接执行,请评估更高密度或支持 Quad-SPI 的器件型号。

该器件结合了可靠的擦写性能、低功耗与丰富的写保护机制,适合需要稳定固件存储与中等容量数据保存的各类消费与工业级应用。若需完整电气特性表、指令时序或典型波形图,请说明用途与设计约束,以便提供更详细的参考资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.