WMSIC Electronic Components

PUYA PY25Q64HA-SUH-IR PY25Q64HA

ModelPY25Q64HA-SUH-IR
PackageSOP-8-208mil
BrandPUYA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PUYA PY25Q64HA-SUH-IR
Type
PUYA
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PUYA
Electronic Component
PY25Q64HA-SUH-IR
Electronic Component
1
Package
SOP-8-208mil
Electronic Component
NOR FLASH
Electronic Component
0.345g
Electronic Component
1
Features
positions
Electronic Component
BM0264683731
Electronic Component
64Mbit
Operating Voltage
2.7V~3.6V
Current
15uA
Interface Type
SPI
Electronic Component
100000
Clock Frequency(fc)
133MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PY25Q64HA-SUH-IR 产品概述

一、产品简介

PY25Q64HA-SUH-IR(品牌:PUYA/普冉)是一款容量为64Mbit(8MByte)的串行SPI闪存,专为大批量消费类产品和嵌入式系统设计。器件采用SOP-8-208mil封装,适合存放程序代码、引导固件及数据存储。常见使用场景为将程序从闪存复制到嵌入式或外部RAM后执行,亦可直接用于数据记录与配置存储。

二、主要规格(一目了然)

  • 接口类型:SPI(兼容主流SPI闪存应用)
  • 存储容量:64Mbit = 8MByte
  • 最大时钟频率(fc):133MHz(支持高速读出)
  • 工作电压:2.7V ~ 3.6V
  • 待机电流:15 µA(典型)
  • 擦写耐久性:100,000 次(写/擦循环)
  • 数据保留(TDR):20 年
  • 封装:SOP-8-208mil

三、关键时序与性能

  • 写周期时间(Tw):12 ms(单次写/编程周期参考)
  • 页写入时间(Tpp):500 µs(单页编程典型耗时)
  • 块擦除时间(tBE):约 1 s @ 64KB(大块擦除需考虑较长延时)
    器件提供灵活的擦除架构,页级编程粒度适合频繁小量数据更新,亦支持较大块擦除用于固件更新。

四、功能特性与数据保护

  • 硬件写保护(WP)与绝对写保护功能,便于在系统层面防止误写或篡改
  • 写使能锁存(Write Enable Latch),需显式使能后方可进行写/擦操作,提升安全性
  • 软件写保护(通过状态/保护寄存器位实现)
  • 上电复位(Power-on Reset),确保上电瞬态下的可靠性
    这些特性结合高耐久与长数据保持性,适合对数据完整性要求较高的应用。

五、应用场景

  • 嵌入式系统固件与引导代码存储(程序常见流程为从闪存复制到RAM执行)
  • 消费类电子(TV机顶盒、机顶盒、机顶机、家电控制器等)
  • 数据记录、配置存储、MCU外部程序存储与升级固件存储
  • 需要高速读取与低功耗待机的便携设备

六、设计建议与注意事项

  • 供电设计:在VCC近端放置0.1 µF和1 µF并联去耦电容以抑制瞬态噪声;确保上电/掉电时序满足器件上电复位要求。
  • 写/擦管理:注意页写(500 µs)与块擦除(1 s)带来的延时,写操作前需执行Write Enable并通过状态寄存器轮询确认操作完成。大批量擦写时建议分批处理并设计进度反馈。
  • 写保护:合理利用硬件WP与软件保护位,在产品出厂及关键区域启用绝对写保护以防止误修改。
  • 接口布局:保持SPI信号线短且阻抗匹配;若使用高频(接近133 MHz),注意PCB走线和终端匹配以降低串扰与反射。
  • 热/可靠性:按照器件数据手册评估环境温度范围与焊接工艺,长期数据保留20年需避免极端温度长期应力。

综上,PY25Q64HA-SUH-IR以其64Mbit容量、高速SPI接口、完善的写保护机制与良好的擦写耐久性,适合用于要求存储可靠性和成本效益兼顾的大批量消费类与嵌入式产品。欲获得更详细的引脚排列、电气特性曲线及指令集(读/写/擦除/状态寄存器等),建议参考PUYA官方数据手册以完成最终硬件与软件设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.