WMSIC Electronic Components

PUYA P25D22H-SSH-IT P25D22H

ModelP25D22H-SSH-IT
PackageSOP-8-150mil
BrandPUYA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PUYA P25D22H-SSH-IT
Type
PUYA
Minimum package
10000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PUYA
Electronic Component
P25D22H-SSH-IT
Electronic Component
1
Package
SOP-8-150mil
Electronic Component
NOR FLASH
Electronic Component
0.14g
Electronic Component
1
Features
positions
Electronic Component
BM0265000764
Electronic Component
2Mbit
Operating Temperature
25℃~+85℃
Operating Voltage
2.3V~3.6V
Current
12uA
Interface Type
SPI
Electronic Component
100000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

P25D22H-SSH-IT 产品概述

一、产品简介

P25D22H-SSH-IT 是普冉(PUYA)推出的一款串行闪存器件,容量 2Mbit(256 KB),采用标准 SPI 接口,最大时钟频率可达 85 MHz。器件工作电压为 2.3 V ~ 3.6 V,适配常见的 3.3 V 和 2.5 V 系统电源。产品集成多种写保护机制并具备上电复位(POR)功能,适合存放固件、参数和配置数据的嵌入式设计场景。

二、主要规格

  • 存储容量:2 Mbit(256 KB)
  • 接口类型:SPI(高速,最高 fc = 85 MHz)
  • 工作电压:2.3 V ~ 3.6 V
  • 工作温度:-25 ℃ ~ +85 ℃
  • 待机电流:12 µA
  • 擦写寿命:100,000 次(典型)
  • 数据保留(TDR):10 年
  • 写周期时间(Tw):8 ms
  • 页写入时间(Tpp):2 ms
  • 块擦除时间(tBE):12 ms
  • 封装:SOP-8,150 mil
  • 品牌:PUYA(普冉)

三、功能特性

  • 硬件写保护:通过外部 WP#(或相应引脚)提供物理级写保护,防止意外擦写或编程。
  • 写使能锁存(Write Enable Latch, WEL):典型的 SPI 闪存写使能机制,配合状态寄存器控制写操作。
  • 软件写保护:可通过状态寄存器对特定区域或器件进行软件级保护。
  • 上电复位(POR):上电或电压恢复时器件自动复位,保证寄存器和状态在稳定电源下恢复到安全状态。
  • 高速 SPI:支持高达 85 MHz 的时钟,适合对读出速度有要求的系统。

四、性能参数说明

  • 时序与写入:器件提供页写入时间 Tpp = 2 ms(单页编程),完整写周期 Tw = 8 ms(器件完成写操作并可接受下一次写命令的最小等待时间),块擦除时间 tBE = 12 ms(擦除一个擦除单元所需时间)。具体时序受温度、电源和操作条件影响,请依据设计时的最坏情况作时序裕量。
  • 待机功耗:典型待机电流为 12 µA,适合低功耗或休眠占空较高的嵌入式设备。读写时电流请参考器件详细手册以估算系统功耗。
  • 可靠性:擦写寿命 100,000 次和 10 年的数据保留能力满足大多数工业与消费类应用长期存储需求。

五、封装与电气兼容性

  • 封装:SOP-8(150 mil)封装,便于自动贴片与波峰焊工艺,适配常用 8 引脚 SOIC 焊盘布局。
  • 电压兼容性:器件工作在 2.3 V ~ 3.6 V 范围内,直接兼容 3.3 V 系统;在 5 V 系统中需使用电平转换或选择 5 V 耐受的接口方案以保护器件 I/O。

六、典型应用

  • 嵌入式主控系统的固件存储与引导代码(Boot ROM)
  • 消费电子产品的配置与参数存储
  • 工业控制器的非易失性数据记录
  • 物联网设备(IoT)与边缘节点的固件升级、配置保留
  • 汽车、仪表与医疗设备中对中等容量、长保留期存储的需求场景

七、设计注意事项与可靠性建议

  • 电源与去耦:在 VCC 引脚附近放置合适的去耦电容(如 0.1 µF + 1 µF),保证写入/擦除期间供应稳定,减少因电压跌落导致的写失败概率。
  • 写保护策略:建议结合硬件 WP# 和软件写保护机制使用,在关键数据区域采用软件锁定并在需要更新时由主控显式解锁,避免误写。
  • 时序裕量:写/擦操作需要等待器件完成内部循环,Tw、Tpp、tBE 为典型/最大值参考,系统应实现轮询状态寄存器或遵循器件就绪信号判断写入完成,避免盲等待或超时误判。
  • 温度与寿命:在极端温度下(接近 -25 ℃ 或 +85 ℃)擦写性能和数据保留可能受影响,关键应用建议在设计阶段做加速老化或环境应力测试。
  • 接口兼容:若与主控 MCU 的 SPI 时钟高于 85 MHz,应限制或分频 SPI 时钟以满足器件最大 fc 要求。

总结:P25D22H-SSH-IT 提供了中等容量、低功耗、高速 SPI 接口与多重写保护机制,是存储固件和关键配置数据的可靠选择。具体电流、时序和指令集等详细参数,请结合器件数据手册在设计中验证并进行 PCB 与固件级联调。

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