WMSIC Electronic Components

PUYA P24C02A-UNH-MIR P24C02A

ModelP24C02A-UNH-MIR
PackageDFN8
BrandPUYA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PUYA P24C02A-UNH-MIR
Type
DFN8
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PUYA
Electronic Component
P24C02A-UNH-MIR
Electronic Component
1
Package
DFN8
Electronic Component
EEPROM
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0264601931
Electronic Component
2Kbit
Operating Temperature
40℃~+85℃
Operating Voltage
1.7V~5.5V
Interface Type
I2C
Clock Frequency(fc)
1MHz
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

P24C02A-UNH-MIR 产品概述

一、产品简介

P24C02A-UNH-MIR 是普冉(PUYA)推出的一款低功耗、双线串行 I2C EEPROM,容量为 2Kbit(2048 bit,等同于 256 字节)。器件支持高达 1MHz 的 I2C 时钟频率,适用于需小容量非易失性存储的各类电子系统,用于参数保存、校准数据、序列号与配置信息等。

二、主要规格

  • 接口类型:I2C(兼容标准 I2C/快速模式/快速模式增强至 1MHz)
  • 存储容量:2Kbit(256 字节)
  • 时钟频率 (fc):最高 1MHz
  • 写周期时间 (Tw):典型值 5ms
  • 工作电压:1.7V ~ 5.5V(宽电源兼容)
  • 工作温度:-40℃ ~ +85℃
  • 封装:DFN8
  • 品牌:PUYA(普冉)

三、功能特点

  • 硬件写保护:设有写保护引脚(WP),可以通过外部电平锁定写操作,增强数据安全性和防误写能力。
  • 噪声抑制功能:内置噪声抑制措施,提高 I2C 总线在电磁干扰环境下的数据稳定性和可靠性,减少误动作。
  • 宽电压适应性:1.7V 至 5.5V 的工作范围,便于与低功耗 MCU 及传统 3.3V/5V 系统兼容。
  • 高速通信:支持高达 1MHz 的时钟频率,满足需要较高总线带宽的场景。
  • 小尺寸封装:DFN8 封装占板面积小,适合空间受限的便携或嵌入式应用。

四、典型应用场景

  • 工业控制与数据记录:保存校准系数、运行参数和设备配置。
  • 消费电子与便携设备:记录用户设置、系统信息与固件配置参数。
  • 通讯与物联网设备:存储设备唯一标识、网络配置参数和启动配置。
  • 智能仪表与电表:保留校验数据与历史配置,保证系统重启后参数一致性。

五、设计与使用建议

  • I2C 总线设计:建议在 SDA、SCL 上使用合适阻值的上拉电阻,并考虑总线负载与线长对上拉阻值的影响。对于 1MHz 工作,选择较小的上拉电阻以保证上升时间。
  • 写保护管理:在需要防误写的场合将 WP 接至低电平(或高电平,视器件脚位定义),并在固件中配合写周期管理,避免在写操作进行时断电导致数据损坏。
  • 写周期与时序:写操作后遵循典型写周期 Tw=5ms,建议在写完成前通过器件忙标志(ACK/NACK 或 ACKPolling)确认写完成再进行后续操作。
  • 电源与去耦:在电源引脚附近放置适当的去耦电容(如 0.1µF)以抑制瞬态干扰,保证器件在噪声环境下稳定工作。
  • PCB 布局:DFN8 封装需关注底部散热垫与接地连接,保证良好焊接与热性能;信号线走线尽量短且远离高频干扰源。

六、封装与可靠性信息

DFN8 小型封装利于高密度装配与自动贴装工艺,适合批量生产。器件工作温度范围 -40℃ 至 +85℃ 满足大多数商业与工业级应用需求;在严苛环境下建议进行系统级温度测试与老化验证。

七、采购与替代

P24C02A-UNH-MIR 属于标准 24C02 类别 EEPROM,市面上有多家厂商提供兼容器件。在选择替代产品时,应注意电压范围、时钟支持、写周期、硬件写保护与封装兼容性,确保在硬件与软件层面能够无缝替换。

如需进一步的电气特性曲线、时序图或参考电路图,我可以提供更详尽的资料与布局建议。

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