WMSIC Electronic Components

Prisemi PESDUC2FD5VB

ModelPESDUC2FD5VB
PackageDFN1006
BrandPRISEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Prisemi PESDUC2FD5VB
Type
PRISEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PRISEMI
Electronic Component
PESDUC2FD5VB
Electronic Component
1
Package
DFN1006
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.3pF
Electronic Component
BM0227296744
Voltage
21V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
1uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESDUC2FD5VB — TVS/ESD 单路双向瞬态抑制器(Prisemi)

一、产品概述

PESDUC2FD5VB 是 Prisemi(芯导)推出的一款单通道、双向 TVS/ESD 器件,旨在对高速数据线和敏感端口提供静电放电(ESD)及浪涌(EFT)保护。器件以微小的 DFN1006 封装实现低结电容(0.3 pF)和快速钳位能力,适合空间受限且对信号完整性要求高的设计。

二、主要参数

  • 钳位电压(Vc):21 V
  • 击穿电压(Vbr):8.5 V
  • 反向截止电压(Vrwm):5 V
  • 峰值脉冲功率(Ppp):100 W @ 8/20 µs
  • 峰值脉冲电流(Ipp):5.5 A @ 8/20 µs
  • 结电容(Cj):0.3 pF
  • 反向电流(Ir):1 µA
  • 通道数:单路(Single)
  • 极性:双向(Bidirectional)
  • 类型:ESD/TVS 保护器
  • 防护等级:符合 IEC 61000-4-2(ESD)与 IEC 61000-4-4(EFT)
  • 封装:DFN1006

三、性能解读与应用意义

  • 低结电容 0.3 pF:对高速接口(如 USB、HDMI、LVDS、SATA 或高速差分信号)影响极小,能在保证信号完整性的同时提供保护。
  • 双向结构:可对正负极性浪涌均衡钳位,适合地参考不固定或双向信号线(例如差分对、双极信号)。
  • 钳位电压 21 V 与 5.5 A 峰值脉冲电流:在典型 8/20 µs 浪涌波形下,能够将过电压限制在可接受范围内,保护后端电路免受瞬态能量破坏。
  • 低反向电流 1 µA:在正常工作下漏电小,不会显著增加静态功耗或影响模拟前端精度。

四、封装与 PCB 布局建议

  • 尽量将器件贴近受保护的接口或连接器放置,以缩短寄生电感和走线电阻,提升响应速度与钳位效果。
  • 使用短而粗的接地回流路径,若可能在器件侧放置多个过孔连接到地平面,降低回流阻抗。
  • 对高频差分线,器件并联时注意差分阻抗连续性,避免对阻抗特性造成突变。
  • DFN1006 的焊盘与热沉设计应参考厂家封装建议,保证可靠焊接及良好散热。

五、典型应用场景与选型要点

  • 适用于需要低电容保护的高速接口和测量端口,如移动设备数据接口、摄像头模块、传感器输入和通信线路。
  • 若系统工作电压高于 Vrwm(5 V)或需要更高能量吸收能力,应在选型时对照系统最大瞬态能量并考虑更大功率等级或并联多颗器件。
  • 对于单端高压线路或需要单向钳位的场合,应选择单向 TVS 器件而非双向型号。

六、可靠性与规范

PESDUC2FD5VB 支持 IEC 61000-4-2 和 IEC 61000-4-4 等电磁兼容测试,表明其在标准的静电放电和快速瞬变脉冲测试中具有良好防护能力。实际应用中仍建议在系统级进行验证,包括连接器处、线缆到地的实际耦合路径和工作环境下的耐受性测试。

总结:PESDUC2FD5VB 以其低结电容、小尺寸封装和符合 IEC 标准的防护能力,适合高速度、空间受限且需强抗扰动的接口保护场合。在布板与系统选型时,关注放置位置、接地回流路径及系统工作电压以确保最佳保护效果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.