WMSIC Electronic Components

Power Integrations INN3670C-H606-TL INN3670C

ModelINN3670C-H606-TL
PackageInSOP-24D
BrandPOWER INTEGRATIONS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Power Integrations INN3670C-H606-TL
Type
POWER INTEGRATIONS
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
POWER INTEGRATIONS
Electronic Component
INN3670C-H606-TL
Electronic Component
1
Package
InSOP-24D
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.69g
Electronic Component
1
Features
(OTP); (CC); (CV); (UVP); (OVP); (OCP)
Electronic Component
Electronic Component
Electronic Component
BM0257716029
Electronic Component
CCM;QR;DCM
Operating Temperature
40℃~+105℃
Switching Frequency
60kHz
Electronic Component
Electronic Component
Isolation
Isolated

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

INN3670C-H606-TL 产品概述

一、概述

INN3670C-H606-TL 是 Power Integrations 面向中低功率隔离式 AC-DC 反激电源的高集成控制器/稳压器。器件集成高压开关晶体管(耐压 750V)、准谐振/多工作模式控制与完善的保护功能,典型开关频率 60kHz,采用小型 InSOP-24D 封装,适合对效率、尺寸和可靠性有严格要求的电源方案。

二、主要特性

  • 隔离型反激拓扑控制器,支持副边闭环反馈(optocoupler/TL431 等);
  • 集成 750V 耐压开关晶体管,简化原边设计;
  • 典型开关频率 60kHz,兼顾磁性体体积与转换效率;
  • 支持恒流(CC)与恒压(CV)双模式输出;
  • 多工作模式支持:连续导通模式(CCM)、准谐振/准共振(QR)与断续模式(DCM);
  • 封装:InSOP-24D,利于高密度贴装与散热布局。

三、工作模式与控制

器件可在 CCM、QR 与 DCM 三种模式下工作,适配不同负载与转换器设计目标:QR 用于降低开关损耗与 EMI,CCM 提高轻负载效率与纹波控制,DCM 简化控制并改善欠载稳定性。副边反馈实现精确的 CV/CC 复合控制,适用于需要恒流限流与恒压稳压并重的应用,例如电池充电与 LED 驱动。

四、保护与可靠性

INN3670C-H606-TL 集成全面保护机制,提升系统可靠性:过热保护(OTP)、欠压保护(UVP)、过压保护(OVP)、过流保护(OCP)等。器件工作环境范围广,Ta -40℃ 至 +105℃,适应严苛工况。保护逻辑配合副边反馈能在异常工况下快速响应,防止器件与负载损坏。

五、封装与热管理

InSOP-24D 小型表面贴装封装有利于缩小 PCB 面积和自动化装配。建议在 PCB 设计中配合大面积散热铜箔和短回流路径以保证热阻最小化;对于高功率或密集布局场合,应评估散热垫与通孔过孔以改善结到外壳的热通路。

六、典型应用与设计要点

适合手机/平板充电器、适配器、LED 驱动、电源模块、工业与家电小功率电源等隔离式电源方案。设计时重点关注:初级吸收回路与漏感控制、一次侧 EMI 滤波与差模抑制、次级反馈回路的环路带宽与补偿、以及 OVP/UVP 的阈值设定与容差。利用器件的多模式特性可在不同负载下优化效率与 EMI 表现。

总结:INN3670C-H606-TL 在高压耐受、丰富保护、灵活工作模式与紧凑封装间取得平衡,适合对尺寸、效率与可靠性有综合要求的隔离式反激电源设计。

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