WMSIC Electronic Components

ROHM ESR03EZPJ471

ModelESR03EZPJ471
Package0603
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM ESR03EZPJ471
Type
ROHM
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
ESR03EZPJ471
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.023g
Electronic Component
470Ω
Electronic Component
1
Electronic Component
BM0257437667
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESR03EZPJ471 产品概述

一、产品简介

ESR03EZPJ471 是 ROHM(罗姆)推出的一款贴片厚膜电阻,阻值为 470Ω,阻值精度 ±5%,额定功率 250mW,封装为 0603(公制 1608,约 1.6mm × 0.8mm)。该型号工作电压上限为 150V,温度系数(TCR)为 ±200ppm/℃,工作温度范围 -55℃ 至 +155℃。凭借小体积与中等功率能力,适合于各类消费电子、工业控制及信号处理电路的通用用途。

二、主要电气与环境参数

  • 阻值:470Ω ±5%
  • 额定功率:250mW(额定值,实际使用需根据环境温度和散热情况做降额)
  • 最大工作电压:150V(指电阻两端允许的最大电压)
  • 温度系数:±200ppm/℃(用于估算随温度变化的阻值漂移)
  • 工作温度范围:-55℃ 至 +155℃

举例说明温漂影响:从 25℃ 上升到 125℃(ΔT = 100℃),按 ±200ppm/℃ 计算,阻值变化约为 470Ω × 200×10^-6 × 100 ≈ 9.4Ω(约 2%),在设计精度预算时应予以考虑。

三、结构与安装注意

0603 的小尺寸适合高密度贴装,但相应的热阻与散热面积有限,故在高功耗或高环境温度条件下应注意降额使用。常见安装建议:

  • 采用推荐的焊盘尺寸和合理过孔/散热铜箔布局以改善散热。
  • 兼容常规回流焊工艺,但应避免超出元件允许的温度极限和过长的高温停留时间。
  • 在频繁热循环或机械冲击严重的环境中,应关注焊点完整性与应力分布,必要时考虑更大封装或阻值并联分担功率。

四、应用场景

  • 通用信号与逻辑线路的分压、上拉/下拉电阻
  • LED 驱动和电流限制(注意功耗与电压限制)
  • 模拟前端、传感器接口中的阻值匹配与滤波网络
  • 消费电子、通讯设备、工业控制板卡等需要小体积中等功率元件的场合

五、设计与可靠性建议

  • 功率降额:在高于室温或散热受限的场合,应按器件厂商给出的功率-温度曲线进行降额设计,避免长期工作在极限功率下。
  • 温漂管理:若电路对阻值稳定性要求较高,应考虑采用低 TCR 器件或在电路中做温度补偿。
  • 耐压验证:对于接近 150V 的应用场景,请在样机阶段做实际耐压与绝缘性能验证。
  • 可靠性测试:对极端温度循环、湿热和机械振动敏感的应用场合,建议做加速应力试验以评估长期可靠性。

六、选型建议

若电路对阻值精度、温漂或长期稳定性要求更高,可考虑降低阻值容差(如 ±1%)或选择低 TCR 的金属膜/薄膜电阻;若功率需求超过 250mW,应选用更大封装或功率等级更高的元件。ESR03EZPJ471 在体积受限且需求中等功率与通用稳定性的场合具有较好的性价比。

如需进一步的封装尺寸、回流曲线或可靠性数据,可参考 ROHM 官方规格书或向供应商索取详细资料。

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