WMSIC Electronic Components

ROHM MCR18EZPJ152

ModelMCR18EZPJ152
Package1206
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 21+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM MCR18EZPJ152
Type
ROHM
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
MCR18EZPJ152
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.028g
Electronic Component
1.5kΩ
Electronic Component
1
Electronic Component
BM69414966
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±200ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MCR18EZPJ152(ROHM 贴片电阻)

MCR18EZPJ152 是一款高性能的贴片电阻,属于罗姆(ROHM)公司的电阻系列之一。这款电阻器具有1.5kΩ的阻值、±5%的精度,适用于各种电子设备,特别是汽车电子、工业控制及消费类电子产品。以下是该产品的详细特点和应用场景。

1. 基本参数

  • 阻值:1.5kΩ,适合多种电路设计需要。
  • 精度:±5%,能够满足大多数应用对电阻精度的要求。
  • 功率:额定功率为1/4W(0.25W),在此功率下工作能够确保电阻的正常运行。
  • 温度系数:±200ppm/°C,提供稳定的性能,适应不同温度环境下的变化。
  • 工作温度范围:-55°C至155°C,广泛适用于严苛环境条件的应用。

2. 结构与封装

  • 成分:厚膜结构,确保了电阻的物理和电子稳定性,适合全自动贴装。
  • 封装/外壳:采用1206(3216公制)标准封装,符合SMD(表面贴装)组件常用尺寸,便于在PCB(印刷电路板)上集成。
  • 端子数:2个端子设计,适用于简单电路连接。

3. 特性与标准

  • 汽车级:符合AEC-Q200标准,确保在汽车电子设备中的长期可靠性和稳定性,适合用于汽车控制单元、传感器等关键功能模块。
  • 等级:该贴片电阻的A级别保证了其在高负载及严酷环境条件下的卓越性能。

4. 应用场景

MCR18EZPJ152可广泛应用于以下领域:

  • 汽车电子:如ECU(发动机控制单元)、传感器及仪表板等,适应汽车的高温、高震动环境。
  • 工业控制:用于传感器、控制单元等,能在高负荷和不利环境中保持稳定的工作性能。
  • 消费电子:如家电、移动设备等,需提供精确的电阻值以支持复杂的电路设计。

5. 性能优势

  • 高可靠性:厚膜电阻具有优良的抗环境变化能力,不易受潮和失效,特别适合长时间工作的电子设备。
  • 热稳定性:宽工作温度范围确保了MCR18EZPJ152能在极端温度条件下保持其电阻值的稳定性,尤其适合于对温度敏感的电路。
  • 良好的电气特性:适合高频应用,能够保持良好的电气性能表现。

6. 结论

总之,MCR18EZPJ152是一款非常优秀的厚膜贴片电阻,其众多的技术参数和优良的性能使其成为各种电子设备和电路设计中不可或缺的元件。无论是在汽车电子、工业控制还是消费电子产品中,都能够发挥出其优越特性,为设计师提供可靠的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.