Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM DTC114ECAHZGT116
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ROHM DTC114ECAHZGT116
- Type
- ROHM
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- DTC114ECAHZGT116
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Electronic Component
- BM0095267876
- Operating Temperature
- 55℃~+150℃
- Resistor
- 1.2
- Resistor
- 13kΩ
- Transistor Type
- NPN
- Frequency(f T)
- 250MHz
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：DTC114ECAHZGT116
一、产品简介
DTC114ECAHZGT116 是一款由日本罗姆半导体公司（ROHM）生产的高性能 NPN 预偏压数字晶体管。其独特的设计使其在多种应用场合中表现出色，尤其适合于低功耗电子设备、开关控制、信号放大以及其他需要高频率响应的电路的应用。这款晶体管采用 SOT-23 封装，可以方便地集成到各种电路板中。
二、主要特性
- 晶体管类型：本产品为 NPN 类型晶体管，并具有预偏压特性，适用于低电流信号处理。
- 集电极电流 (Ic)：该晶体管的最大集电极电流为 100mA，适合用作中小功率负载的开关和线性放大器。
- DC 电流增益 (hFE)：在 10mA 和 5V 的条件下，DTC114ECAHZGT116 的 DC 电流增益 (hFE) 至少为 30，这意味着它可以有效地放大输入信号。
- 饱和压降 (Vce)：在 500µA 和 10mA 的条件下，其最大饱和压降仅为 300mV，有助于提高功率转化效率，减少发热量。
- 频率响应：具备高达 250MHz 的跃迁频率，使其在高频信号应用中表现出色，是超高速开关和信号处理的理想选择。
- 功率处理能力：最大功率为 350mW，确保设备在高负载条件下的稳定性与安全性。
- 易于安装：采用表面贴装型设计，适应现代电子设备对空间和重量的苛刻要求，有助于缩小电路板的实际尺寸。
三、技术参数
- 基极电阻 (R1)：10 kOhm，提供合适的基极驱动电流。
- 发射极电阻 (R2)：10 kOhm，有助于稳定晶体管的工作状态。
- 封装：产品采用主流的 SOT-23 封装形式，便于自动化贴片和焊接。
- 供应商器件封装：SST3，确保与主流电路板设计兼容。
四、应用领域
DTC114ECAHZGT116 适用于多种应用场景：
- 开关应用：常用于开关电源、继电器驱动等需要控制大电流的电路。
- 信号放大器：在音频处理、无线通信等领域，可以用于放大微弱的信号。
- 数字电路：由于其低功耗特性，该晶体管非常适合用于无源信号调理及数字逻辑电路。
- 传感器驱动：可以作为传感器信号放大的前级放大器，在环境监测和工业控制中发挥重要作用。
五、总结
DTC114ECAHZGT116 NPN 预偏压数字晶体管是罗姆公司的一款高效、可靠的电子元器件，凭借其优越的电气特性和广泛的应用潜力，成为各种电子产品设计中不可或缺的组件。无论是在消费电子、通信设备还是工业自动化系统中，它都能为设计师提供强有力的支持，助力开发出更加智能、节能的电子产品。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
