Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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DTC114YETL 是一款来自 ROHM(罗姆)公司的 NPN 数字晶体管,专为满足现代电子产品的性能要求而设计。这款晶体管具有卓越的电气特性,支持多种应用场景,尤其适合用于开关电路和信号放大。其设计中包含预偏压技术,方便了用户在电路中的应用。该器件的封装类型为 EMT3(SOT-416),使其在表面贴装技术(SMT)中占有一席之地,适合于紧凑空间设计。
安装类型:表面贴装型 (SMD)
DTC114YETL 采用表面贴装设计,便于自动化焊接和组装,提高了生产效率并减小了总体尺寸。
电流参数:
该晶体管能够处理的最大集电极电流为 70 mA,适合需要中等电流驱动的应用。同时,其低截止漏电流特性(500 nA)使其在低功耗电路中表现优异。
电压参数:
DTC114YETL 的最大集射极击穿电压可达 50 V,提供了一定程度的电压保护,确保其在较高电压环境下的稳定性。
饱和压降:
在 250 µA 和 5 mA 的状态下,该器件的 Vce 饱和压降最大为 300 mV,这意味着其在开关操作中的功耗极低,有助于提升电源效率。
频率特性:
DTC114YETL 支持高达 250 MHz 的跃迁频率,适合于在高速信号处理和通信应用中使用。
功率处理:
在提供稳定电流和电压的前提下,DTC114YETL 最大功率可以达到 150 mW,确保器件在高功率环境下仍能合理运行。
增益参数:
在 5 mA 和 5V 的条件下,DTC114YETL 的最低电流增益为 68,充分保证了其驱动能力,为电路设计提供了充足的灵活性。
基极和发射极电阻:
这些电阻值为电路设计中的偏置设置提供了便利,使设计人员可以轻松调整和优化电路性能。
DTC114YETL 可广泛应用于各种电子设备中,包括但不限于:
综上所述,DTC114YETL 是一款高性能、低功耗的 NPN 数字晶体管,其出色的电路特性和多种应用潜力使其成为现代电子产品设计中不可或缺的组件。凭借 ROHM 的品牌实力和技术支持,DTC114YETL 将会在未来的电子市场中持续发挥重要作用,为用户带来更高的设计自由度和可靠性。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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