Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2SCR572D3TL1 是一款由罗姆(ROHM)公司设计的高性能 NPN 晶体管,封装形式为 TO-252,为表面贴装型(SMD)设计。该晶体管的额定功率可达 10W,适用于多种高效能电子应用。
集电极电流 (Ic)
该器件的最大集电极电流为 5A,使其能够在重载条件下稳定工作,适合在功率放大和开关电路中使用。
集射极击穿电压 (Vce)
其最大集射极击穿电压为 30V,这为设备提供了良好的电源兼容性,使其适合在需要较高电压的应用环境中工作。
饱和压降 (Vce(sat))
在 100mA 和 2A 的不同负载条件下,Vce 的饱和压降最大值为 400mV。这一特性意味着该晶体管在进行开关操作时,能够以较低的能耗转换状态,提高了整体能效。
截止电流 (ICBO)
截止状态时的集电极电流最大值为 1µA,这表明该器件在非导通状态时具有较高的绝缘性,适合低功耗场景。
DC 电流增益 (hFE)
在 500mA 的集电极电流下,电流增益的最小值为 200。这使得该晶体管在放大电路中表现出色,能够有效地提高信号的强度。
2SCR572D3TL1 的频率跃迁特性达到了 300MHz,意味着其在高频应用中也能稳定工作。广泛应用于开关电源、射频放大器和高频信号处理等领域。
该晶体管的工作温度范围可以达到150°C,极大地提高了其在高温环境下的适用性,使其能够在严苛条件下正常工作。
由于其优秀的电气性能,2SCR572D3TL1 适用于多种应用场景:
2SCR572D3TL1 使用 TO-252 封装形式,具有良好的散热性能,安装简便,适合大规模生产和工艺自动化。其紧凑设计为空间有限的电子电路提供了更多灵活性。
综上所述,2SCR572D3TL1 是一款在性能、可靠性和适用性上均表现卓越的 NPN 晶体管。无论是对于需要高功率、高电流、低饱和压降的应用,还是对频率性能和环境耐受性有特别要求的设计,2SCR572D3TL1 均能满足其需求。选择此款晶体管,将为您的设计带来显著的性能提升和可靠性保证,是现代电子设备和系统中不可或缺的重要元器件。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products