WMSIC Electronic Components

ROHM RB168VYM-40FHTR RB168VYM

ModelRB168VYM-40FHTR
PackageTUMD2M
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM RB168VYM-40FHTR
Type
ROHM
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
RB168VYM-40FHTR
Electronic Component
1
Package
TUMD2M
Electronic Component
Schottky Diode
Electronic Component
0.017g
Electronic Component
1
Electronic Component
BM0229970483
Current
1A
Diode
1
Current(Ir)
500nA@40V
(Vf)
790mV@1A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB168VYM-40FHTR — ROHM 肖特基二极管产品概述

一、产品概述

RB168VYM-40FHTR 是 ROHM(罗姆)推出的一款肖特基整流二极管,面向需要低正向压降、低反向漏电且体积小的电源与保护电路应用。该器件在 1A 直流电流时的典型正向压降为 790 mV,直流反向耐压为 40 V,反向电流在 40 V 时典型值为 500 nA,适合 12V/24V 等常见电源轨的整流、反向保护与续流场合。

二、主要性能指标

  • 型号:RB168VYM-40FHTR(ROHM)
  • 二极管类型:肖特基整流二极管
  • 正向压降(Vf):0.79 V @ If = 1 A
  • 直流反向耐压(Vr):40 V
  • 连续整流电流:1 A
  • 反向电流(Ir):500 nA @ Vr = 40 V(典型)
  • 封装:TUMD2M(表面贴装,具体外形和尺寸请参见厂商资料)
  • 包装形式:带卷(FHTR 表示厂商的卷带/出货方式,具体以出货单为准)

三、核心优势

  1. 低正向压降:在 1 A 工作点 Vf = 0.79 V,可降低整流损耗与发热,提升效率(需按功耗计算实际温升)。
  2. 极低反向漏电:40 V 下反向漏电约 500 nA,利于降低待机能耗与提高电源静态性能,适合电池供电与待机敏感系统。
  3. 快速开关特性:肖特基二极管本征具有很小的反向恢复电流,适合高频开关电源中的输出整流或续流二极管。
  4. 小型封装:TUMD2M 小体积,有利于密集 PCB 布局和轻小型化设计。

四、典型应用场景

  • 开关电源(SMPS)输出整流或同步二极管补充:用于 1A 级输出或小功率辅助轨。
  • DC-DC 变换器的续流/钳位二极管:高频下反向恢复小,能降低开关损耗。
  • 电池管理、充电器和电源路径选择:低漏电减少待机损耗,适合便携设备。
  • 极性保护/反接保护:反向导通防护设计中用作低压降保护元件。
  • 一般整流、保护电路和信号隔离场合。

五、应用注意事项与设计建议

  • 功耗与散热:在 If = 1 A 时,器件在导通状态下约有 P = Vf × If ≈ 0.79 W 的功耗。若长时间工作在一安培等级或出现脉冲电流,需在 PCB 上留足铜箔散热或考虑并联/更大功率器件。具体结温与结到环境热阻请以 ROHM 数据手册为准。
  • 漏电随温度上升:肖特基器件的反向漏电随结温上升显著增大,实际高温环境中 Ir 会远高于室温 500 nA,设计时应考虑最大工作温度下的漏电和热稳定性。
  • 工作电压范围:Vr = 40 V,适合 12V/24V 常见轨但不适合高压(例如 >40V)系统,选型时注意最大反向电压裕量。
  • 开关频率:肖特基二极管适合高频应用,但在高频、大电流情况下请评估寄生电感、导通损耗和瞬态电压尖峰,并适当添加 RC 吸收或缓冲网络。
  • PCB 布局:将二极管的热焊盘放置在大铜面积上以提升散热,走线尽量短且加粗以降低寄生阻抗。若用于高脉冲电流路径,应优化过孔与散热走线。
  • 焊接与可靠性:遵循 ROHM 的回流焊曲线与湿敏等级(MSL)要求进行贴装处理,避免过高回流温度或多次回流导致可靠性下降。

六、封装与采购信息

  • 封装类型:TUMD2M 表面贴装(具体尺寸、焊盘建议和封装图请参考 ROHM 官方数据手册)。
  • 出货包装:FHTR(通常表示卷带供货,便于自动贴片机加工)。
  • 订购时请确认器件完整型号与批次编码,并参照 ROHM 的最新库存与交期信息。

七、品质与可靠性

ROHM 作为元器件制造商在半导体二极管领域具有成熟的制造与质量控制体系。实际产品在出货前应通过焊接可靠性、温度循环、功率循环与电气一致性测试。设计前建议下载并阅读 RB168VYM-40FHTR 的官方规格书,确认所有极限参数(如峰值脉冲电流、结温上限、热阻等)以便进行安全裕度设计。

如需进一步的电气参数曲线(Vf–If、Ir–Vr 随温度曲线)、封装尺寸图或参考电路样例,我可以帮您列出需要查询的关键图表与下载链接建议。

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