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ROHM LTR18EZPF1001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM LTR18EZPF1001
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 1W
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- LTR18EZPF1001
- Electronic Component
- 1
- Package
- 0612
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.028g
- Electronic Component
- 1kΩ
- Electronic Component
- 1
- Electronic Component
- BM0232343107
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTR18EZPF1001 产品概述
一、概述
LTR18EZPF1001 是 ROHM（罗姆）系列的贴片厚膜电阻，标称阻值 1kΩ，公差 ±1%，额定功率 1W，温度系数（TCR）±100 ppm/℃，工作温度范围 -55 ℃ 至 +155 ℃，封装规格为 0612（约 1.5 mm × 3.0 mm）。该产品面向对功率密度和精度有较高要求的贴片电路，兼顾耐热、稳定性与批量可装配性，适用于工控、电源与通信等领域。
二、主要性能特点
- 厚膜工艺：成熟可靠，成本与工艺兼顾，适合大批量生产。
- 精度高：±1% 阻值公差，满足精密分压、偏置与电流检测等场合的阻值要求。
- 功率等级：1W 额定功率，在小尺寸封装中提供较高功率承载能力（注意散热条件影响）。
- 宽温范围：工作温度 -55 ℃ ~ +155 ℃，适应工业级环境。
三、电气与热特性说明
- 标称阻值：1kΩ，阻值随温度按 ±100 ppm/℃ 变化，适用于对温漂有一定控制的电路设计。
- 功率与热管理：1W 为在参考环境与散热条件下的额定值，实际应用中需考虑PCB铜箔面积、周围元器件与通风条件，必要时参考厂家降额曲线以避免过热导致寿命下降。
四、封装与机械特性
0612 封装尺寸约为 0.06" × 0.12"（约 1.5 mm × 3.0 mm），适合自动贴装与回流焊工艺。厚膜结构对机械冲击和焊接热循环具有良好耐受性，但仍建议按 ROHM 推荐的装配与焊接规范操作。
五、可靠性与环境适应
产品设计适应工业级温度与较苛刻工作环境，常见符合项包括耐热老化、温度循环与湿热试验（具体测试条件请参照 ROHM 规格书）。对于高可靠性场合，建议在设计时预留适当的功率裕量并避免长期在极限温度下工作。
六、典型应用
- 工业控制与传感器接口电路
- 开关电源的分压/检测电阻
- 通信设备、基站及终端的偏置/限流场合
- 仪器仪表及汽车电子（需确认具体车规认证）
七、选型与使用建议
- 在高功耗或散热受限的线路板上，优先增加铜箔面积或使用散热槽以提升散热能力。
- 对温漂敏感的应用，可考虑更低 TCR 的电阻或温度补偿电路。
- 焊接时遵循供应商的回流曲线与焊接工艺规范，避免超出热循环导致性能退化。
- 在关键可靠性场合，参考 ROHM 官方规格书与可靠性报告进行详细评估。
八、结语
LTR18EZPF1001 以其 1W 功率、±1% 精度与工业级温度范围，在需要中等功率与较好精度的贴片电阻应用中具有良好性价比。最终选型与可靠性验证应结合具体电路热平衡与环境条件，并参考 ROHM 官方资料与样品测试结果。
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