WMSIC Electronic Components

ROHM RB560VM-40FHTE-17 RB560VM

ModelRB560VM-40FHTE-17
PackageSOD-323FL
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM RB560VM-40FHTE-17
Type
ROHM
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
RB560VM-40FHTE-17
Electronic Component
1
Package
SOD-323FL
Electronic Component
Schottky Diode
Electronic Component
0.026g
Electronic Component
1
Electronic Component
BM0257346245
Current
500mA
Diode
1
Current(Ir)
40uA@40V
(Vf)
640mV@500mA
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RB560VM-40FHTE-17 产品概述

一、概述

RB560VM-40FHTE-17 是 ROHM(罗姆)推出的一款肖特基势垒二极管,面向空间受限的中低功率整流与保护场景。器件采用紧凑的 SOD-323FL 封装,提供低正向压降与较小的反向漏电流特性,适合用于便携终端、功率管理与开关电源辅助回路等需要低损耗与快速响应的应用。

二、主要特点

  • 正向压降(Vf):约 640 mV(在 If = 500 mA 时)。低 Vf 有助于降低导通损耗与发热。
  • 直流反向耐压(Vr):40 V,适用于常见的 12 V、24 V 级别短路或防反接保护。
  • 正常整流电流:500 mA(DC),满足中等电流传输需求。
  • 反向电流(Ir):40 μA(Vr = 40 V),在室温下保持较低漏电,利于电池供电系统的待机能耗控制。
  • 非重复峰值浪涌电流(Ifsm):2 A(脉冲),可承受瞬态冲击与启动浪涌。

三、关键电性能解读

  • 正向压降(Vf):在 If = 500 mA 时 Vf ≈ 640 mV,表明在中等电流下器件的导通损耗较小,有利于提高效率并降低器件温升。设计时应根据实际电流乘以 Vf 估算功耗(P ≈ If × Vf)。
  • 反向电流(Ir):40 μA 在 40 V 下属于较低级别,但需注意漏电流随温度上升呈指数增加,若在高温环境或供电待机场景使用,应验证在目标温度下的漏电是否满足系统要求。
  • 耐压与浪涌能力:40 V 的反向耐压适合常见低压系统;2 A 的峰值浪涌能力可应对短时启动或瞬态情况,但不宜用于长时间大电流冲击。

四、典型应用场景

  • 便携式设备中的输入反向保护(系列整流),避免电池反接或外部电源反接导致损坏。
  • 开关电源中的续流/钳位二极管,用于小功率 DC-DC 转换器的输出整流或续流路径。
  • LED 驱动与显示背光电路的保护与整流(在电流与功耗允许范围内)。
  • 汽车电子或工业控制中低压辅助电源的浪涌保护与整流(需结合环境温度与安全裕度)。

五、封装与热设计建议

  • SOD-323FL 为超小型表贴封装,适合 PCB 高密度布局。由于封装体积小,器件的热阻相对较高,长时间大电流工作会引起显著升温。
  • 布局建议:尽可能在器件引脚处提供铜箔散热面积,并通过加宽走线或增加散热填充来降低结温。关键是保证在连续 500 mA 工作时器件结温在可靠范围内。
  • 焊接建议:该封装常见于无铅回流工艺,建议按照厂家回流温度曲线和湿敏等级处理。

六、使用注意事项与可靠性

  • 温度影响:肖特基二极管的反向漏电流和正向特性受温度影响显著,设计时应对高温场景进行额外余量计算。
  • 浪涌与重复冲击:Ifsm 为非重复峰值浪涌电流 2 A,适合一次性或短时冲击。若系统存在频繁浪涌或较长时序的大电流冲击,应选用额定更高的器件或并联/增加限流保护。
  • ESD 与过压:如用于输入端,请配合 TVS、电阻或保险丝等外围防护元件,提升整体抗干扰与安全性。
  • 可靠性验证:在最终产品中,应进行温升、电流循环及环境试验(高低温、湿热、振动等)以验证长期可靠性。

七、选型建议与替代器件

  • 若目标为更低正向压降或更高电流能力,可考虑同类封装中额定电流更高或 Vf 更低的肖特基器件;若需更高耐压,可选择 60 V 或更高 Vr 的型号。
  • 在选型时需平衡 Vf、Ir、Vr 及封装热性能:便携低功耗优先考虑低 Vf 和低 Ir;工业或汽车应用则需更高耐压与更强热特性。
  • 选型时同时确认封装兼容性(SOD-323FL)与制造商供应情况,以保证可持续供应与一致的质量标准。

八、结论

RB560VM-40FHTE-17 是一款面向中低功率、空间受限场合的肖特基二极管,具有低正向压降、较低反向漏电与适中的浪涌容限。它适合用于便携设备电源保护、开关电源辅助整流及一般防反接方案。设计时需关注散热与温度对漏电与损耗的影响,并根据实际应用环境对器件进行必要的可靠性验证。

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