WMSIC Electronic Components

ROHM EDZVFHT2R4.7B

ModelEDZVFHT2R4.7B
PackageSC-79(SOD-523)
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM EDZVFHT2R4.7B
Type
ROHM
Unit
Electronic Component
Minimum package
8000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
EDZVFHT2R4.7B
Electronic Component
1
Package
SC-79(SOD-523)
Electronic Component
Zener Diode
Electronic Component
0.05g
Electronic Component
1
(Zzk)
800Ω
(Zzt)
100Ω
Electronic Component
BM0229970491
Diode
1
Current(Ir)
2uA@1V
Power Dissipation(Pd)
150mW
Electronic Component
4.55V~4.75V
Electronic Component
8000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EDZVFHT2R4.7B 产品概述

一、概述

EDZVFHT2R4.7B 是 ROHM(罗姆)推出的一款低功耗稳压二极管,稳压值标称 4.7V(规格范围 4.55V〜4.75V),单个独立封装,适合做小电流的参考电压或过压钳位。器件以 SC-79 (SOD-523) 超小型表面贴装封装提供,适用于空间受限和移动电源设计。

二、主要电气参数

  • 稳压值:4.55V ~ 4.75V(名义 4.7V)
  • 反向电流 Ir:2 μA @ 1V
  • 耗散功率 Pd:150 mW
  • 动态阻抗 Zzt:100 Ω(在测试电流条件下)
  • 膝部阻抗 Zzk:800 Ω(表示低电流区的阻抗特性)

三、性能解读与设计要点

由于 Pd=150 mW,理论最大稳压电流约为 Pd/Vz ≈ 150 mW / 4.7 V ≈ 31.9 mA。但实际应用中应留有裕度并考虑封装散热限制,典型稳态工作电流常控制在数 mA 级以保证稳定性与寿命。Zzt 值越小,输出随电流变化越稳定;Zzk 较大表明在非常低电流时稳压特性进入膝区,电压变化较敏感。

四、典型应用与选型建议

适合用作:低功耗参考电压、传感器供偏、基准源、简单的电压钳位或浪涌吸收。选型时若需更精确参考或更大电流,应选用更高功率或低阻抗型号;对温度漂移和噪声有严格要求的场合建议采用专用电压参考芯片。

五、典型电路与计算示例

常用的稳压电路为串联限流电阻 R 与稳压二极管并联负载:R = (Vin − Vz) / Iz。
示例:若 Vin=12V,要给稳压管 5 mA 工作电流,则 R = (12 − 4.7) / 0.005 ≈ 1.46 kΩ,同时检查稳压管耗散 Pd = Vz × Iz ≈ 4.7 × 0.005 = 23.5 mW,远低于额定 150 mW,有足够余量。

六、封装与工艺注意

SC-79 (SOD-523) 为微小 SMD 封装,焊接时注意焊接热量与回流曲线,避免过热导致元件性能变化。存储和装配过程中应注意静电防护和潮湿敏感度,具体焊接谱和工艺参数建议参照 ROHM 官方数据手册。

若需完整电气特性曲线、温度系数或封装机械尺寸,请参阅 ROHM 的产品资料与规格书以获得详细的测试条件和典型曲线。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.