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ROHM ESR03EZPF2400
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM ESR03EZPF2400
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- ESR03EZPF2400
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.022g
- Electronic Component
- 240Ω
- Electronic Component
- 1
- Electronic Component
- BM0257353073
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ROHM ESR03EZPF2400 产品概述
一、产品简介
ESR03EZPF2400 是 ROHM（罗姆）推出的一款 0603 封装厚膜贴片电阻，标称阻值 240Ω，阻值公差 ±1%，额定功率 250mW。该器件适用于对体积、成本和可靠性有要求的通用电子电路，广泛用于消费电子、工业控制、仪表和通信设备的分流、分压和阻抗匹配等场景。
二、主要电气参数
- 电阻类型：厚膜（Thick film）贴片电阻
- 阻值：240Ω
- 阻值精度：±1%（高精度等级，适合一般容差敏感应用）
- 额定功率：250mW（0603 封装典型功率等级）
- 温度系数（TCR）：±100 ppm/℃（中等温漂，适合多数温度范围内的稳定应用）
- 工作温度范围：-55℃ 至 +155℃
三、封装与机械特性
- 封装形式：0603（公制 1608，约 1.6 mm × 0.8 mm；英制 0.06" × 0.03"）
- 适配常规 SMT 贴装与回流焊工艺，体积小、利于高密度布局
- 厚膜结构具备良好的抗机械振动和冲击能力，焊盘设计需参考厂商推荐以保证焊接可靠性
四、应用建议
- 电压分压、信号偏置和限流网络
- 模拟前端的精密阻抗网络（在 ±1% 和 ±100 ppm/℃ 条件可满足多数应用）
- 高频电路中的阻抗终端与匹配，注意厚膜电阻的寄生电感、电容应在高频时考虑
- 不建议用于高功率或需要极低温漂（如精密测量）且超过额定功率的场合
五、选型与设计注意事项
- 功率热耗散：0603 的 250mW 为常温额定值，使用时需参考 PCB 铜面积、散热条件及环境温度对功率的降额（derating）曲线，避免在高温环境下长期超过额定能耗。
- 温度系数：±100 ppm/℃ 在温度变化较大时会导致阻值显著漂移，若为精密测量或高稳定性需求，可考虑更低 TCR 的薄膜或金属膜电阻。
- 高频特性：厚膜电阻在高频下存在寄生参数，进行射频设计时需查阅厂商的等效模型或测试数据。
- 焊接工艺：采用推荐的回流焊温度曲线，避免过热或过长回流时间以保证阻值和可靠性。
六、存储与处理
- 建议按厂商箱带（tape & reel）供货并在干燥条件下储存，避免潮湿环境导致焊接缺陷。
- 贴装过程中应避免机械划伤和过度弯折，焊接后建议进行目视或 X 光检查，必要时做阻值与可靠性抽检。
- 常规静电保护措施（ESD）有助于提高元件出货良率和器件寿命。
七、总结
ROHM 的 ESR03EZPF2400（0603，240Ω，±1%，250mW，厚膜）在体积、成本和通用性上具有良好平衡，适合多种消费类和工业控制类电路的常规电阻应用。设计时需关注功率热管理和温漂特性，在高稳定性或高频应用场景下可根据需要选择更合适的替代规格或咨询 ROHM 数据手册获取详细性能曲线与可靠性数据。
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