WMSIC Electronic Components

ROHM MCR01MZPF1501

ModelMCR01MZPF1501
Package0402
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM MCR01MZPF1501
Type
ROHM
Minimum package
10000 圆盘

Technical parameters

Power
63mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
MCR01MZPF1501
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.007g
Electronic Component
1.5kΩ
Electronic Component
1
Electronic Component
BM0000537140
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MCR01MZPF1501 贴片电阻

基础参数

MCR01MZPF1501是一款高性能的贴片电阻,具有1.5 kΩ的阻值,适用于各种电子应用,特别是在汽车电子领域。其产品特性包括±1%的精确容差和±100ppm/°C的温度系数,使其在严苛的工作环境中表现出色。

功率和性能

该贴片电阻的功率额定值为0.063W(即1/16W),能够适应各种功率需求的电路设计。低功耗的特点使其特别适合于电池驱动或高效能的设备。其工作温度范围从-55°C到155°C,这一广泛的温度适应性确保了该产品在极端气候条件下的可靠性及稳定性。

电子特性

MCR01MZPF1501采用厚膜工艺制造,目前提供的汽车级AEC-Q200等级认证,使其符合汽车行业的严格标准。这一特点使得该产品可以广泛应用于现代汽车的电子控制单元、传感器和其他关键系统中,确保其长期稳定运行和安全性。

封装和尺寸

该电子元件采用0402封装标准,尺寸为1.00mm x 0.50mm,符合小型化和高密度布线需求。最大高度为0.40mm,适合在空间受限的应用中使用。其小巧的结构使得电路设计师在设计电路板时可以有效节省空间,同时保持高性能状态。

端子和安装

MCR01MZPF1501具有两个端子,便于在电路板上焊接和安装,适用于自动化贴片生产线,减少了人工操作的失误和成本。在设计过程中,针对常见的温度变化,这款电阻器能够有效地减少因端子松动或焊接不良而带来的信号干扰和电阻值漂移。

应用领域

由于其卓越的性能和稳定性,MCR01MZPF1501适合用于多个领域,包括但不限于:

  • 汽车电子:用于提升电流感测、信号处理和电路保护的功能。
  • 工业自动化:在传感器、控制器和变频器等关键设备中确保高精度和高稳定性。
  • 消费电子:例如智能手机、家电和穿戴设备,提升产品的整体性能和用户体验。

结论

MCR01MZPF1501 厚膜贴片电阻是一款集高精度、宽温度范围和小型化设计于一体的优质电子元件,非常适合当前市场对高性能和高可靠性电子产品的需求。凭借ROHM在电阻器制造领域的卓越声誉,MCR01MZPF1501无疑是工程师设计电路的理想选择。这款电阻器不仅满足传统电路的需求,更为未来智能化、自动化的应用场景提供了强有力的技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.