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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM RB530SM-30T2R RB530SM
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM RB530SM-30T2R
- Type
- ROHM
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- RB530SM-30T2R
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.01g
- Electronic Component
- 1
- Electronic Component
- BM0229970482
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 500nA@10V
- (Vf)
- 450mV@10mA
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RB530SM-30T2R 产品概述
一、产品简介
RB530SM-30T2R 是 ROHM（罗姆）推出的一款肖特基势垒二极管，采用超小型 SOD-523 封装，专为空间受限的便携与功率管理应用设计。该器件在 10 mA 工况下正向压降仅为 450 mV，直流反向耐压 30 V，持续整流电流 200 mA，反向漏电流 500 nA@10 V，非重复峰值浪涌电流 1 A。整体性能在低压、低损耗场合表现优异。
二、主要技术参数
- 正向压降 Vf：450 mV @ IF = 10 mA
- 直流反向耐压 VR : 30 V
- 持续整流电流 IF(AV) : 200 mA
- 反向漏电流 IR : 500 nA @ VR = 10 V
- 非重复峰值浪涌电流 Ifsm : 1 A
- 封装：SOD-523（极小表面贴装）
三、主要特性与优势
- 低正向压降：减小导通损耗，有利于提高系统效率并延长电池寿命。
- 低反向漏电：在待机或低功耗模式下可降低泄漏功耗。
- 小体积封装：SOD-523 方便在高度受限的 PCB 布局中实现元件密集化。
- 良好浪涌能力：1 A 非重复峰值浪涌可满足短时启动或突发电流需求。
四、典型应用场景
- 移动设备、可穿戴、IoT 终端的电源路径与反相保护
- 低压 DC-DC 转换器的二极管回路与续流路径
- USB/电池供电系统的 ORing 与反向隔离
- 低功耗传感器、便携式电子产品中的肖特基替代整流
五、封装与热管理建议
SOD-523 为极小封装，热阻相对较高；建议在 PCB 设计时：
- 增大与二极管相连的大面积铜箔以扩散热量；
- 必要时在焊盘下方或附近布置过孔连接内层/底层散热铜箔；
- 缩短引线与走线长度以降低寄生电阻和发热。
同时注意按温度－电流降额使用，避免长时间接近额定整流电流。
六、使用注意事项与选型建议
- 使用前请查阅并参照 ROHM 正式数据手册获取完整热阻、极限值和降额曲线；
- 若电路存在持续高电流或高温工况，建议选用额定电流更高或散热更好的封装型号；
- 对于对反向漏电敏感的应用，需评估在高温下的 IR 上升；
- 焊接时遵循 SOD-523 的回流焊工艺规范，避免超出温度/时间限制导致元件失效。
如需样片、器件文档或等效替代型号，可联系供应商或参考 ROHM 官方资料以完成最终选型验证。
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