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ROHM ESR03EZPF1502
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM ESR03EZPF1502
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- ESR03EZPF1502
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.024g
- Electronic Component
- 15kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264889539
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ROHM ESR03EZPF1502 厚膜贴片电阻产品概述
一、产品核心定位与身份识别
ROHM ESR03EZPF1502是罗姆半导体推出的通用型厚膜贴片电阻，属于其ESR系列常规精度型号。该产品以0603（英制封装，对应公制1608）为载体，主打“小体积、低成本、宽温区稳定”特性，适配消费电子、工业控制、通信设备等多领域小功率电路，是替代插件电阻、提升电路集成度的理想选择。
二、关键电气性能参数解析
核心参数围绕“阻值精度、功率容量、温度稳定性”设计，具体如下：
1. 阻值与精度
标称阻值15kΩ，精度±1%，满足大多数模拟电路需求——例如5V电源分压3.3V时，误差仅约33mV，无需校准即可稳定工作；工业传感器信号调理中，可确保弱信号放大的增益一致性。
2. 功率额定值
额定功率250mW，0603封装下的主流功率等级。最大允许电流约4.08mA（I=√(P/R)），适配小电流电路（如5V限流、12V分压），避免过载导致阻值漂移。
3. 温度系数与工作温区
温度系数±100ppm/℃，即温度每变1℃，阻值变化1.5Ω；结合**-55℃+155℃**宽温区，全温区阻值最大变化315Ω（相对变化2.1%），覆盖工业级（-40125℃）及极端户外场景。
4. 抗干扰与可靠性
厚膜工艺赋予其较好抗浪涌能力（优于薄膜电阻），绝缘电阻>1GΩ，避免漏电流干扰电路。
三、机械封装与可靠性优势
1. 0603封装适配性
尺寸1.6mm×0.8mm×0.5mm，体积小、重量轻，可大幅提升电路板集成度，适配高密度SMT自动化生产线。
2. 焊接与环境可靠性
- 兼容回流焊/波峰焊，符合ROHM推荐曲线（峰值240260℃，持续1030s），焊接牢固；
- 耐湿性能达J-STD-020标准，可在40%~90%RH环境长期工作，抗振动能力10g/500Hz。
四、典型应用场景覆盖
该产品适配多领域，核心场景包括：
- 消费电子：手机音频调理、智能家电电源管理、便携式设备传感器接口；
- 工业控制：PLC I/O限流、工业传感器信号调理、电机驱动分压；
- 通信设备：小型基站信号分压、光纤收发器偏置、无线模块匹配；
- 汽车电子（辅助）：车载仪表盘背光调节、低功率传感器处理、USB充电限流。
五、选型与使用注意事项
- 功率降额：实际功率不超额定值80%（200mW），避免长期过载；
- 温度影响：极端温度下评估阻值变化，精度要求高时可加补偿；
- 焊接控制：回流焊升温速率<3℃/s，波峰焊确保引脚浸润；
- 存储管理：开封后72小时内焊接，暴露过长需120℃/24h烘烤去潮。
该产品平衡成本与性能，是中小功率电路厚膜电阻的主流选型，可满足多场景稳定工作需求。
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