Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM KTR18EZPF1503
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM KTR18EZPF1503
- Type
- ROHM
- Minimum package
- 5000
Technical parameters
- Power
- 250mW
- Electronic Component
- ROHM
- Electronic Component
- KTR18EZPF1503
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.028g
- Electronic Component
- 150kΩ
- Electronic Component
- 1
- Electronic Component
- BM0230825181
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 500V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KTR18EZPF1503 — ROHM 贴片厚膜电阻 产品概述
一、产品简介
KTR18EZPF1503 是 ROHM（罗姆）推出的一款 1206 封装厚膜贴片电阻，阻值 150 kΩ，精度 ±1%，额定功率 250 mW，额定工作电压 500 V，温度系数（TCR）±100 ppm/℃，工作温度范围 -55℃ 至 +155℃。该系列以稳定性、成本效益和良好的焊接兼容性为特点，适用于高阻值、空间受限的 SMT 应用。
二、关键电气参数与使用要点
- 阻值：150 kΩ（1503 编码）
- 精度：±1%
- 额定功率：250 mW
- 额定工作电压：500 V（请注意：此为器件的最大工作电压规范，非连续功率限制）
- 温度系数：±100 ppm/℃（约 ±0.01%/℃，即每℃ 阻值变化约 15 Ω）
- 工作温度：-55℃ ～ +155℃
重要说明：根据功率限制，器件在连续工作时允许的最大两端电压由 P = V^2 / R 决定。对 150 kΩ、250 mW 的器件，连续允许电压约为 194 V（Vmax = sqrt(P·R) ≈ 193.6 V），对应最大电流约 1.29 mA（Imax = sqrt(P/R) ≈ 1.29 mA）。因此在高电压应用中应同时考虑功耗与额定电压，避免因超过功率限值造成过热或失稳。
三、应用场景
- 高阻抗偏置网络、输入保护与采样电路
- 高压分压器、测量与感测模块（需注意功耗分配）
- 精密模拟电路中的串联或偏置电阻
- 通用 SMT 电阻替换与批量布板设计
四、封装与装配建议
1206（约 3.2 mm × 1.6 mm）封装，适配常见 SMT 回流工艺（兼容无铅回流），建议注意：
- 采用推荐 PCB 焊盘与阻焊开窗以降低热应力；
- 回流焊峰值温度与曲线请参考 ROHM 官方工艺说明；
- 避免在焊接或后处理过程中对电阻端点施加机械应力，以免引起开路或阻值漂移；
- 在高功率或高环境温度场合，应采用必要的散热和功率降额策略以保证长期可靠性。
五、可靠性与选型提示
厚膜电阻成本与通用性优良，但相对于薄膜产品 TCR 与噪声略高。选型时应结合系统允许的温漂、噪声指标及长期漂移要求；若需更高稳定性或极低 TCR，应考虑薄膜或金属膜系列。最终选型与批量采购前，请以 ROHM 最新数据手册为准，并在目标工况下做样件测试验证（温度循环、湿热、焊接后阻值变化等）。
若需规格书、样品或 PCB 布局参考图，请联系 ROHM 或其授权分销商获取原厂资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
