WMSIC Electronic Components

ROHM MCR01MZPJ330

ModelMCR01MZPJ330
Package0402
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM MCR01MZPJ330
Type
ROHM
Minimum package
10000 圆盘

Technical parameters

Power
63mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
MCR01MZPJ330
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
33Ω
Electronic Component
1
Electronic Component
BM0000536480
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:MCR01MZPJ330 - 厚膜贴片电阻

1. 产品简介

MCR01MZPJ330是一款由Rohm Semiconductor生产的高品质厚膜贴片电阻,封装尺寸为0402(1.00mm x 0.50mm),其阻值为33Ω,容差为±5%。这款电阻器主要适用于汽车电子产品和其他对电子元器件特性有高要求的应用场景,其符合AEC-Q200标准,表明其在汽车环境中的可靠性。

2. 主要规格

  • 阻值:33Ω
  • 容差:±5%
  • 功耗:最大功率为0.063W(即1/16W),适用于低功耗电路设计。
  • 温度系数:±200ppm/°C,确保在温度波动较大的环境中,电阻值的稳定性。
  • 工作温度范围:-55°C至155°C,适应严苛的工作条件。
  • 封装类型:0402,具有优良的小型化特性,便于在空间受限的电路板上使用。
  • 材料:采用厚膜技术制造,具有优良的温度特性和可靠性。

3. 设计特性

MCR01MZPJ330的厚膜成分使其在宽广的工作温度范围内保持良好的电性能,适合于高频和高温的应用场景。这种电阻的设计利用了现代微电子制造工艺,使其更加紧凑,同时保持高度的稳定性和低噪声特性。此外,该电阻采用卷带(TR)包装,方便自动化贴装,提高了生产效率。

4. 应用场景

由于其优越的性能,MCR01MZPJ330被广泛应用于以下几个领域:

  • 汽车电子:作为可靠性高的元件,该系列电阻适合在汽车控制单元、传感器和其他关键电子部件中使用,满足潜在的温度变化与电气负荷要求。

  • 消费电子:对于需要高精度和稳定性的消费电子产品,如智能手机、平板电脑和其他便携式设备,MCR01MZPJ330同样合适。

  • 工业设备:在工业控制及自动化设备中,具有良好的抗干扰能力和稳定性的电阻是必不可少的,MCR01MZPJ330能够满足这些要求。

5. 竞争优势

与市场上的其他品牌相比,MCR01MZPJ330的主要竞争优势在于其严格的生产标准和优质的材料选择。Rohm Semiconductor以其高品质和可靠性闻名,常常在激烈的市场竞争中脱颖而出。AEC-Q200认证进一步保证了其在汽车级应用中的可靠安全性,可以放心用于需要满足国际标准的项目。

6. 总结

MCR01MZPJ330是一款性能卓越的厚膜贴片电阻,具有小型化、高稳定性及优良的功率消耗特性,适用于汽车、消费电子和工业等多种应用场景。凭借Rohm Semiconductor的技术支持,MCR系列电阻为客户提供高品质和高可靠性的解决方案,是现代电子设计中不可或缺的核心元器件之一。在选择电阻元件时,MCR01MZPJ330无疑是一个值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.