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ROHM RB520HS-30T15R RB520HS
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM RB520HS-30T15R
- Type
- ROHM
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- RB520HS-30T15R
- Electronic Component
- 1
- Package
- SOD-962
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.007g
- Electronic Component
- 1
- Electronic Component
- BM0257346246
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 300nA@10V
- (Vf)
- 430mV@10mA
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RB520HS-30T15R 产品概述
一 特点概述
RB520HS-30T15R 为 ROHM（罗姆）出品的独立式肖特基二极管，采用 SOD-962 小封装，面向空间受限且需低压降整流或保护用途的应用场景。典型正向压降仅 0.43V（IF=10mA），在低电流条件下可显著降低功耗与发热。器件具备 30V 的直流反向耐压、200mA 的整流电流能力以及 1.5A 的非重复峰值浪涌承受能力。
二 主要电气参数
- 正向压降 Vf：0.43V（IF = 10mA，典型值）
- 直流反向耐压 Vr：30V（最大额定反向电压）
- 直流整流电流：200mA（连续允许电流，需根据散热条件适当降额）
- 反向漏电流 Ir：300nA（VR = 10V，典型量级，随温度上升显著增加）
- 非重复峰值浪涌电流 Ifsm：1.5A（单次冲击能力，短时使用）
- 封装：SOD-962（超小型表面贴装，适合高密度 PCB 布局）
三 典型应用场景
- 便携电源和电池供电设备的整流与反向保护（电源 OR-ing、反接防护）
- 高速开关电源中的低压差整流与钳位电路
- 信号线路的防护和低电流整流场合
- 需要小封装以节省 PCB 面积的消费电子与传感器模组
四 封装与热特性
SOD-962 为极小型封装，优点在于占位小、适合集成密集电路板。但封装体积受限导致散热能力有限，器件的连续整流电流与功耗需结合实际 PCB 散热（铜箔面积、过孔/散热片）进行降额使用。建议查阅 ROHM 官方数据手册获取准确的结温与热阻参数，以便进行可靠的热设计。
五 设计与布局建议
- 将器件放置于靠近电源输入或受保护节点的位置，以缩短回路长度并降低寄生电感。
- 在承载较大连续电流时扩大焊盘铜箔并增加过孔，改善热量传导。
- 注意反向漏电流随温度上升而增大，若工作环境温度高，应评估漏电对系统的影响并适当选型。
- 对于含有浪涌脉冲的应用，应保证峰值电流不超过 Ifsm，或采用额外浪涌抑制元件。
六 可靠性与注意事项
器件在高温或高电压边缘工作时，反向漏电与热累积可能成为限制因素。焊接工艺应符合 ROHM 的回流曲线规范并注意防潮处理。用于关键负载保护时，推荐留有足够的安全裕度（电压、温度与电流均需降额设计）。
七 选型参考
当需求为小封装、低正向压降与低电流整流时，RB520HS-30T15R 是经济且性能均衡的选择。若系统需要更高连续电流或更高反向耐压，应考虑更大封装或额定更高的肖特基器件。最终选型应以官方数据手册及实际温升测试为准，以确保长期可靠运行。
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