WMSIC Electronic Components

ROHM ESR10EZPJ330

ModelESR10EZPJ330
Package0805
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM ESR10EZPJ330
Type
ROHM
Minimum package
5000 圆盘

Technical parameters

Power
400mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
ESR10EZPJ330
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.027g
Electronic Component
33Ω
Electronic Component
1
Electronic Component
BM0188690861
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:ESR10EZPJ330 贴片电阻

一、产品简介

ESR10EZPJ330是ROHM(罗姆)公司生产的一款高性能贴片电阻,具有33Ω的标称电阻值,容差为±5%,功率额定值达到0.4W(对应于2/5W),特别设计用于满足严苛的汽车电子应用需求。此款电阻符合AEC-Q200汽车级标准,保障了其在各种环境下的稳定性和可靠性。

二、产品特性

  1. 电阻值与容差: ESR10EZPJ330提供33Ω的电阻值,适合一些对电流和电压有严格要求的电路;±5%的容差使其在实际应用中具有更大的灵活性。

  2. 功率额定值: 最大功率可达0.4W,适用范围广,能够满足低到中等功率电路的需求,确保电路在长时间输出下的稳定性。

  3. 材料与技术: 采用厚膜技术制造,具备出色的耐久性和稳定性。厚膜电阻器因其优良的温度与负载稳定性,广泛应用于消费电子和高可靠性电子设备中。

  4. 温度系数: 温度系数为±200ppm/°C,能够在宽温度范围内保持较小的电阻变化,这是对设备稳定性至关重要的特性。

  5. 工作温度范围: 工作温度范围宽广,从-55°C到155°C,适用于极端温度条件下的应用,满足汽车、军事和工业等领域的需求。

  6. 封装与尺寸: 该电阻采用0805(2012公制)封装,尺寸为2.00mm x 1.25mm,最大高度为0.65mm。小巧的设计使其适合自动化贴片贴装,能够有效降低PCB占用空间。

三、应用场景

ESR10EZPJ330主要应用于汽车电子、工业控制、消费电子等领域,以满足日益增长的可靠性和耐久性需求。在现代汽车中,电阻器广泛应用于控制电路、传感器和驱动电路中,承担着信号调节和电流限制的重要角色。

此外,厚膜电阻的抗脉冲特性使其在恶劣环境下依然能够正常工作,尤其适用于电动汽车和混合动力汽车等要求高稳定性的应用。

四、优势与市场竞争力

  1. 高可靠性: 符合AEC-Q200标准,ESR10EZPJ330在汽车电子应用中具备较高的可靠性,适应汽车行业的严格要求。

  2. 优秀的热稳定性: 在高温和快速变化的温度环境中,电阻值的稳定性显著表现出其热稳定性,适合复杂的电路设计需求。

  3. 设备兼容性: 作为一款尺寸小巧的贴片电阻,ESR10EZPJ330可以轻松集成到各类电子设备中,与其他元器件兼容性良好,有助于简化电路设计和提高生产效率。

五、总结

ESR10EZPJ330是一款优质的厚膜贴片电阻,适用于汽车、工业及消费电子等多个领域。凭借出众的电气性能、极宽的工作温度范围及优秀的抗脉冲能力,这款电阻能够满足用户对高可靠性与高性能的需求,是现代电子设备中不可或缺的重要元器件。无论是在自动驾驶辅助系统,还是在电动汽车的控制模块中,ESR10EZPJ330都能为广大设计者和工程师提供理想的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.