WMSIC Electronic Components

ROHM KDZVTR4.7B

ModelKDZVTR4.7B
PackageSOD-123FL
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM KDZVTR4.7B
Type
ROHM
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
KDZVTR4.7B
Electronic Component
1
Package
SOD-123FL
Electronic Component
Zener Diode
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0227699848
Diode
1
Current(Ir)
20uA@1V
Power Dissipation(Pd)
1W
Electronic Component
4.7V~5.2V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KDZVTR4.7B 产品概述

一、产品简介

KDZVTR4.7B 是 ROHM(罗姆)推出的独立式稳压二极管,标称稳压值 4.7V,实际稳压范围 4.7V~5.2V。器件以 SOD-123FL 表贴封装提供,适合空间受限的表面贴装应用,常用于低功耗电路的稳压、基准与浪涌抑制场合。

二、主要性能参数

  • 型号:KDZVTR4.7B(ROHM)
  • 稳压值(标称):4.7V
  • 稳压范围:4.7V ~ 5.2V
  • 反向电流 Ir:20 µA @ VR = 1.0V(典型泄漏,随温度上升)
  • 耗散功率 Pd:1W(器件极限,实际使用需考虑散热与降额)
  • 封装:SOD-123FL(小型表贴,适合自动贴装与回流焊)

三、典型应用场景

  • 作为旁路稳压(Shunt Regulator)提供低成本的参考电压或局部稳压
  • 过压或浪涌抑制,保护敏感器件或接口线路
  • 电源监测、偏置电路、仪表与传感器前端的基准源

四、封装与焊接注意事项

SOD-123FL 为小型塑封表贴件,焊接推荐使用回流焊工艺。注意控制回流温度曲线与焊盘尺寸,避免过度温度导致器件应力。为保证 1W 功耗时的可靠性,应关注 PCB 的铜箔散热面积与热阻路径,必要时加大铜箔或通过孔以改善散热。

五、选型与使用建议

  • 热设计:稳压二极管的耗散功率 Pd = Vz × Iz。若在器件上承受全部稳压功率,则 Iz_max ≈ Pd / Vz ≈ 1W / 4.7V ≈ 213 mA,但长期工作时应按降额原则设计(通常远低于峰值)。
  • 串联限流:在用作旁路稳压时,通过 R 限流:R = (Vin − Vz) / I。设计时需兼顾最小工作电流(保证 Vz 稳定)与最大电流(不超过 Pd)。
  • 泄漏与温漂:Ir 在低电压下为 20 µA(@1.0V),温度上升会使泄漏增大,对高阻负载或精密基准场合需额外注意。
  • 参考原厂规格书:如需更详细的温度系数、动态电阻、最大反向电压等参数,请参照 ROHM 的数据手册以获得完整规范与典型曲线。

六、可靠性与品质保证

ROHM 品牌提供产业级制造与测试,适合工业与消费类电子。为确保长期可靠性,建议在实际电路中进行热仿真与寿命验证,遵循封装焊接规范,并在设计中留有安全余量,避免器件长时间在极限功耗下工作。

综上,KDZVTR4.7B 以小型表贴封装、约 4.7V 的稳压特性和 1W 的耗散能力,适合用于多种低成本稳压与保护应用,是空间受限电路中常用的稳压二极管选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.