Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM MCR01MZPF4531
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM MCR01MZPF4531
- Type
- ROHM
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 63mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- MCR01MZPF4531
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 4.63kΩ
- Electronic Component
- 1
- Electronic Component
- BM0000537100
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MCR01MZPF4531 产品概述
概述
MCR01MZPF4531 是由知名品牌 ROHM（罗姆）生产的高性能贴片电阻，其具有 63mW 的功率评级、4.63kΩ 的电阻值以及 ±1% 的精度。该元器件采用 0402 封装，属于厚膜电阻类型，广泛应用在众多电子电路中，尤其是在需要高精度和小型化解决方案的场合。
产品特点
电阻值与精度：MCR01MZPF4531 的电阻值为 4.63kΩ，适用于多种电路设计，如滤波器、反馈环路以及信号调节等。其 ±1% 的精度确保了在设计中能够获得可靠的性能，减少了因电阻值偏差对电路功能的影响。
功率处理能力：此贴片电阻的额定功率为 63mW，使其适合在中低功率应用中使用，能够有效应对多种电子设备的能量需求。其设计考虑到了功率密度，以保证在过载情况下也能维持良好的稳定性。
厚膜技术：MCR01MZPF4531 采用厚膜金属涂层技术制造，这种技术相较于薄膜技术在成本上更具优势，同时也能提供足够的热稳定性和可靠性。厚膜电阻通常具有良好的耐久性，适合各种温度和湿度环境下运行。
0402 封装：0402 封装尺寸为 1.0mm x 0.5mm，是当前电子设计中常用的小型封装格式之一。这样的设计不仅有助于缩小电路板的尺寸，提升空间利用率，还能让更复杂的电路设计成为可能，使电路板集成度更高。
应用领域：MCR01MZPF4531 以其出色的性能适用于多个行业，包括消费电子、通信设备、工业控制、汽车电子、医疗设备等。无论是信号传输还是电源分配，该电阻均能有效工作，并满足多样化的设计需求。
应用示例
在消费电子产品如智能手机和平板电脑中，MCR01MZPF4531 可以用于音频放大器电路，以稳定信号并确保音频质量。同时，在工业控制系统中，它也可用于传感器的信号调理电路，以提供准确的测量和反馈。在汽车电子中，该电阻适合用于电源管理和动力分配，以提高系统的整体能效。
技术数据
- 电阻值: 4.63kΩ
- 额定功率: 63mW
- 容忍度: ±1%
- 封装类型: 0402
- 温度系数: 100ppm/°C（具体参数可参考实际数据手册）
结论
MCR01MZPF4531 作为 ROHM 推出的高性能贴片电阻，凭借其优良的电气特性和紧凑的封装设计，为现代电子产品提供了极大的设计灵活性和可靠性。无论是在轻型消费产品还是复杂的工业设备中，该电阻都能发挥重要作用，成为设计工程师的得力助手。选择 MCR01MZPF4531，您将能够在电路设计中实现更高的效率和性能。同时，ROHM 作为全球知名的电子元器件制造商，确保了该产品在质量和性能上的一贯优秀，值得信赖。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
