WMSIC Electronic Components

ROHM DTC114EMT2L

ModelDTC114EMT2L
PackageSOT-723
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM DTC114EMT2L
Type
ROHM
Unit
Electronic Component
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
DTC114EMT2L
Electronic Component
1
Package
SOT-723
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0000001027
Operating Temperature
55℃~+150℃
Resistor
1
Resistor
10kΩ
Transistor Type
NPN
Frequency(f T)
250MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DTC114EMT2L 产品概述

产品背景与概述

DTC114EMT2L 是一款高性能的 NPN 型预偏压数字晶体管,由知名电子元器件制造商 ROHM(罗姆)生产,采用SOT-723封装。该晶体管专为低功耗应用设计,拥有额定功率和集电极电流的极限参数,适用于广泛的电子电路中,包括开关电源、信号放大、开关控制及数字电路等。

主要特性

  • 额定功率与电流:DTC114EMT2L 的额定功率为 150mW,集电极电流(Ic)最大为 50mA,适合要求较低功率和电流的多种应用。这一特性使其成为电池供电设备及小型电子产品的理想选择。

  • 集射极击穿电压(Vce):该晶体管的集射极击穿电压为 50V,提供稳定的操作性能,确保在电源不稳定或过压情况下依然能够保护电路组件不受损坏。

  • 电流增益(hFE):在 5mA 的集电极电流和 5V 的条件下,DTC114EMT2L 的直流电流增益(hFE)最小为 30。这一增益特性确保了它在信号放大时能保持高效的性能,使其适于音频放大器及其他信号处理应用。

  • 饱和压降:在500µA的基极电流和10mA的集电极电流下,饱和压降最大为300mV。这一参数尤为重要,可以减少功耗,提高电路的整体效率。

  • 频率特性:DTC114EMT2L 的跃迁频率为 250MHz,适用于高速开关和信号处理应用,能够满足大多数数字电路对频率响应的需求。

  • 截止电流:在无信号输入的情况下,集电极截止电流高达 500nA,这一极低的漏电流特性使其在待机模式中表现出色,延长电池的使用寿命。

封装与安置

DTC114EMT2L 采用 SOT-723 表面贴装封装,体积小巧,适合高密度组装和自动化贴装工艺。其紧凑的设计使得它在有限的电路空间中也能与其他元器件有效配合,为现代小型化电子设备提供了便利。此外,VMT3 封装特性为良好的热管理提供了支持,确保在高负载条件下操作的安全性。

应用领域

由于其卓越的电气性能和高集成度,DTC114EMT2L 可广泛应用于以下领域:

  • 移动通信设备:在手机、平板等便携设备中的信号放大和开关控制。
  • 消费电子:如音频设备、电视机及嵌入式系统的驱动电路。
  • 工业自动化:用于传感器信号处理、继电器驱动和开关电路控制。
  • 家庭医疗设备:包括便携式监测仪器和体温计等。

总结

DTC114EMT2L 以其卓越的性能参数、便捷的封装和广泛的适用领域,成为当今电子市场上受欢迎的选择。无论是设计师还是工程师都能在其高效的性能和小型化的体积中找到理想的解决方案。ROHM(罗姆)品牌的稳健质量更是为该产品的市场表现提供了强大的保障。选择 DTC114EMT2L,意味着选择了高效、稳定和可靠的电子解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.