Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM EDZVT2R18B
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ROHM EDZVT2R18B
- Type
- ROHM
- Unit
- Electronic Component
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- EDZVT2R18B
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Zener Diode
- Electronic Component
- 0.021g
- Electronic Component
- 1
- (Zzk)
- 80Ω
- (Zzt)
- 65Ω
- Electronic Component
- BM0257640314
- Diode
- 1
- Current(Ir)
- 100nA@13V
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- 17.56V~18.35V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EDZVT2R18B 产品概述
产品简介
EDZVT2R18B 是一款高性能稳压二极管，隶属于 ROHM（罗姆）品牌，专为电压稳压和过压保护而设计。该器件采用表面贴装型方案，封装形式为 SC-79（也称 SOD-523），兼具小型化和高效能的特点，适用于空间受限且对性能要求高的电子应用。
技术参数
EDZVT2R18B 的典型稳压值为 18V，电压范围在 17.56V 到 18.35V 之间，具备 ±2%的高精度，能够在各种工作条件下提供稳定的输出电压。在反向偏置情况下，该二极管的反向漏电流极低，仅为 100nA（在 13V 时测得），这为应用于需要长时间可靠运行的电子设备提供了保证。
功率和温度特性
该器件的最大功率限制为 150mW，适合在低功耗应用中使用。此外，EDZVT2R18B 具有广泛的工作温度范围，从 -55°C 到 150°C，确保其在极端环境下的稳定性。这使其适合于航空航天、工业控制以及汽车电子等严苛条件的应用。
阻抗与性能
在设计中，该二极管的最大阻抗 (Zzt) 为 65 Ohms，这意味着在稳压状态下，器件对于输入电压的变化具有较好的抑制能力，能够有效地减小输出电压的波动。这一参数使得 EDZVT2R18B 成为高要求的稳压应用中的理想选择。
封装和安装
EDZVT2R18B 的 SC-79 封装使其极为适合表面贴装 (SMD) 工艺，减少了 PCB 板的空间占用，同时提升了组装效率。这种小巧的封装形式也使得它能够轻松集成到各种紧凑型电路中，提升了设计的灵活性与可扩展性。
应用场景
EDZVT2R18B 广泛应用于：
- 消费电子：例如智能手机、平板电脑、电视等产品中的电源管理电路。
- 工业设备：用于各种工业控制单元和设备内的电压稳压电路。
- 汽车电子：在电动车和传统汽车的电子控制模块中，保证系统稳定运行。
- 通信设备：用于基站、路由器等通信设备的电源供应部分。
总结
EDZVT2R18B 结合了小型化、高精度、低功耗和宽温度范围的优势，使其成为现代电子设计中不可或缺的稳压解决方案。ROHM 品牌以其卓越的技术背景和持续创新，在业界内赢得了良好的声誉。选择 EDZVT2R18B，不仅能有效提高产品的可靠性和稳定性，也能为设计者在产品开发中提供更多的灵活性与保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
