WMSIC Electronic Components

ROHM DTC023YMT2L

ModelDTC023YMT2L
PackageSOT-723
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM DTC023YMT2L
Type
ROHM
Unit
Electronic Component
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
DTC023YMT2L
Electronic Component
1
Package
SOT-723
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0000080958
Resistor
4.5
Resistor
2.2kΩ
Transistor Type
NPN
Frequency(f T)
250MHz
Power Dissipation(Pd)
150mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DTC023YMT2L 产品概述

1. 产品简介

DTC023YMT2L 是由日本罗姆电子公司(ROHM)推出的一款高性能数字晶体管,采用表面贴装型封装,型号为 SOT-723,内部结构为 NPN 预偏置。该器件专为低功耗应用设计,具有适中的电流与电压承受能力,特别适合于便携式电子设备和数字电路中信号的放大与开关控制。

2. 技术参数

  • 晶体管类型: NPN,预偏置
  • 最大集电极电流 (Ic): 100mA
  • 最大集射极击穿电压 (Vce): 50V
  • 基极电阻 (R1): 2.2 kOhms
  • 发射极电阻 (R2): 10 kOhms
  • 直流电流增益 (hFE): 在不同的 Ic、Vce 条件下,最小值为 35 @ 5mA,10V
  • 饱和压降 (Vce(sat)): 在不同的 Ib、Ic 条件下,最大值为 150mV @ 500µA,5mA
  • 频率响应: 跃迁频率为 250MHz
  • 最大功率: 150mW
  • 封装类型: SOT-723
  • 供应商器件封装: VMT3

3. 应用场景

DTC023YMT2L 尤其适用于以下应用场景:

  • 便携式设备: 由于其低功耗特性和适合的电压与电流范围,DTC023YMT2L 非常适合手机、平板电脑及其他便携式电子产品中作为开关和放大元件。
  • 数字电路: 该晶体管在数字电路中可通过切换方式进行信号放大,因而被广泛应用于计算机外围设备、数字信号处理(DSP)等领域。
  • 高频应用: 由于其达到 250MHz 的跃迁频率,该元件能够有效处理高速信号,适用于无线通信、RF 信号处理等需求。

4. 性能优势

  • 小型化设计: SOT-723 封装的设计使得 DTC023YMT2L 在空间有限的应用中表现出色,为电子产品的轻薄化提供了支持。
  • 高增益: 具备显著的直流电流增益(hFE),使得即使在较小的输入信号条件下也能实现较大的输出电流,适应各种电路设计需求。
  • 快速响应: 250MHz 的跃迁频率表明 DTC023YMT2L 能够快速响应输入信号的变化,适合高速开关应用。

5. 设计注意事项

在使用 DTC023YMT2L晶体管时,需要注意其最大集电极电流和射极击穿电压,以避免损坏器件。同时,合理选择基极与发射极电阻 (R1 和 R2) 的值,将直接影响到电流放大效果和功耗。因此,设计师在电路设计时,需根据具体应用进行相应的参数优化。

6. 结论

DTC023YMT2L 是一款高质量的数字晶体管,凭借其良好的电流增益、快速的频率响应及适中的功率处理能力,广泛应用于现代电子设备中。无论是在音频放大、信号处理还是其他低功耗需求的场景中,DTC023YMT2L 都能够提供可靠的性能,为设计师的创意和技术实现提供坚实的基础。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.