WMSIC Electronic Components

ROHM EDZVFHT2R15B

ModelEDZVFHT2R15B
PackageSC-79(SOD-523)
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM EDZVFHT2R15B
Type
ROHM
Unit
Electronic Component
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
EDZVFHT2R15B
Electronic Component
1
Package
SC-79(SOD-523)
Electronic Component
Zener Diode
Electronic Component
0.01g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
42Ω
Electronic Component
BM0252997494
Diode
1
Current(Ir)
100nA@11V
Power Dissipation(Pd)
150mW
Electronic Component
14.34V~14.98V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EDZVFHT2R15B 产品概述

一、概述

EDZVFHT2R15B 为 ROHM(罗姆)公司推出的一款小功率稳压二极管,标称稳压值约 15V,额定耗散功率 150mW,封装为 SC-79(SOD-523)超小型贴片。该器件以体积小、漏电流低、动态阻抗适中为主要特点,适用于对体积与静态功耗有严格要求的便携与消费类电子产品中作为基准稳压或过压钳位元件。

二、主要参数解析

  • 稳压电压:约 15V(标称值,具体应用时请参考厂方完整曲线与容差)
  • 反向电流 Ir:100nA @ 11V,表示在较低偏压下的漏电表现,适合对静态电流要求较高的电路场景。
  • 耗散功率 Pd:150mW,为器件在规定环境温度下可持续吸收的最大功率,属于小功率类稳压二极管,选用时需注意功率热管理与降额使用。
  • 动态阻抗 Zzt:42Ω,表征在规定电流下稳压点的内阻,阻抗越低稳压精度相对越好;42Ω 表明在微小电流条件下仍能提供一定的稳压能力但有一定压降随流变化。

三、典型应用场景

  • 便携设备的次级电源基准或参考电压源(需注意功率与热管理)
  • 信号线或输入端的过压钳位与保护电路
  • 低功耗偏置与电平限制等场合,尤其是对漏电流敏感的电路

四、封装与 PCB 布局建议

SC-79(SOD-523)封装体积非常小,焊盘设计应遵循 ROHM 推荐的尺寸与过孔摆放原则,以保证良好焊接可靠性。由于 Pd 仅 150mW,建议:

  • 在二极管焊盘周围保留适当的铜面积以利于热扩散;
  • 若功耗接近额定值,考虑在器件下方与周边设置散热铜箔或通过多层板的内层铜来分散热量;
  • 推荐使用标准回流焊工艺,注意温度曲线与焊接温度上限,避免超温影响器件特性。

五、使用注意事项

  • 热降额:在高环境温度或连续吸收较大功率时,请按厂家提供的温度-功率降额曲线进行设计,避免器件过热导致特性漂移或失效;
  • 启动与稳压电流:小功率稳压二极管通常在较低测试电流下具有较高的动态阻抗,应用中应保证有足够的工作电流以达到期望稳压精度,或采用串联限流元件控制电流;
  • 暂态/浪涌保护:针对偶发浪涌或脉冲能量,考虑在前端增加限流或浪涌吸收措施,以保护小功率稳压二极管不被瞬态能量损坏。

六、选型建议

在选型时,若电路对稳压精度、功率承受或温漂有更高要求,可考虑功率更大或动态阻抗更低的封装与型号;若对体积与漏电流有更严格限制,可在同类小封装产品中比较 Ir 与 Pd 的折衷。建议在最终定型前参考 ROHM 的完整数据手册与典型特性曲线,并进行电路与热仿真验证。

七、结语

EDZVFHT2R15B 适合追求极小封装与低漏电的 15V 小功率稳压场合。合理的 PCB 布局和热管理、正确的工作电流设计是发挥其性能的关键。推荐在样机阶段对稳压精度、温升及浪涌耐受性做充分验证,确保长期可靠运行。

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