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ROHM DTA143EU3T106
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM DTA143EU3T106
- Type
- ROHM
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- DTA143EU3T106
- Electronic Component
- 1
- Package
- SOT-323
- Electronic Component
- 1 PNP
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Electronic Component
- BM0058428614
- Operating Temperature
- 55℃~+150℃
- Resistor
- 1
- Resistor
- 4.7kΩ
- Transistor Type
- PNP
- Frequency(f T)
- 250MHz
- Power Dissipation(Pd)
- 200mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DTA143EU3T106 产品概述
一、产品简介
DTA143EU3T106 是 ROHM（罗姆）生产的一款预偏置数字晶体管（PNP），采用小型 SOT-323 封装，适用于空间受限的表贴电路。器件集成了输入限流电阻（标称 4.7 kΩ），便于直接与微控制器或逻辑电平相连，简化外围电阻设计。器件额定参数保证中低功率、高电压和宽温度范围下可靠工作，适合一般开关和驱动应用。
二、主要电气特性
- 极性：PNP（预偏置，内部带基极电阻）
- 集电极-发射极击穿电压 Vceo：50 V，适合较高电压工作场合
- 最大集电极电流 Ic：100 mA（短时或受散热限制）
- 直流电流增益 hFE：30（测量条件 10 mA，VCE≈5 V）
- 导通输出电压 VO(on)：约 300 mV（Ic = 10 mA 时典型值）
- 输入电阻（内置基极电阻）：4.7 kΩ
- 最大耗散功率 Pd：200 mW（注意封装与环境温度影响）
- 工作温度范围：-55 ℃ 至 +150 ℃
三、功能与优点
- 预偏置设计：内部集成基极电阻，缩短设计周期、减少外部元件数量，降低 PCB 布局复杂度。
- 小体积封装：SOT-323 占板面积小，适用于便携设备与高密度电路板。
- 良好的开关特性：在 10 mA 等常见负载下低饱和压降（约 300 mV），提高效率并减小功耗。
- 宽温度与高电压能力：50 V 的 Vceo 和宽工作温度范围适用于汽车电子、工业与消费类电子中的多种环境。
四、典型应用场景
- 低功率高侧/低侧开关（小电流负载驱动）
- LED 驱动与指示灯控制
- 逻辑接口与电平移位（直接由 MCU/逻辑门驱动）
- 传感器信号开/关、外围电路使能控制
- 电池供电与便携设备中的省件型开关解决方案
五、使用注意事项与设计建议
- 散热与功耗：Pd 为 200 mW，SOT-323 封装散热能力有限，高集电极电流下需注意封板散热或降低占空比，避免长期在额定最大功耗工作。
- 驱动电平：器件设计用于与标准逻辑兼容，但在不同电压和负载条件下，导通所需输入电平和基极电流会变化。建议在具体电路中以目标负载电流下验证 VO(on)、hFE 与开关速度。
- 保护与可靠性：若负载存在感性成分（如小继电器线圈），请添加反向保护二极管或 RC 抑制网络，防止高压尖峰损伤晶体管。
- 替代与扩展：如需更高电流或更大功耗，请选择更大封装或专用功率晶体管；若需 NPN 极性，可选相应型号以匹配电路需求。
六、总结
DTA143EU3T106 为一款集成基极电阻的 PNP 数字晶体管，具有 50 V 耐压、100 mA 电流能力与 200 mW 功耗等级，适合中低功率、空间受限场合的开关与驱动应用。其预偏置特性大幅简化设计，是实现小型化、快速开发的实用选择。在实际应用中应结合散热与开关条件进行验证，以确保长期可靠性。
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