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ROHM KDZVTFTR30B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM KDZVTFTR30B
- Type
- ROHM
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- KDZVTFTR30B
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Zener Diode
- Electronic Component
- 0.023g
- Electronic Component
- 1
- Electronic Component
- BM0261486774
- Diode
- 1
- Current(Ir)
- 10uA@23V
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 30V~34V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Electronic Component
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ROHM KDZVTFTR30B 稳压二极管产品概述
KDZVTFTR30B是日本罗姆（ROHM）推出的一款30V标称稳压值表面贴装稳压二极管，主打小体积、低功耗与电压稳定性，适配消费电子、工业控制、通信设备等领域的小型化电路需求。
一、核心身份与应用定位
作为罗姆稳压二极管系列中的中压型号，KDZVTFTR30B定位于通用稳压+过压防护双功能器件：
- 可作为电源电路基准源，为MCU、传感器等敏感元件提供稳定30V左右电压；
- 能在电路过压时通过反向击穿泄放多余电流，保护后端器件；
- 小封装设计尤其适合便携式设备、小型工业模块等对空间要求严格的场景。
二、关键电气参数解析
参数针对小型化应用优化，核心特性清晰：
1. 稳压特性
- 标称稳压值：30V（额定电流下的典型输出）；
- 稳压范围：30V~34V（温度/电流波动下的电压一致性较好，适合中等精度需求）；
- 温度系数推测：罗姆同类器件通常为±0.05%/℃，宽温环境下电压漂移可控。
2. 功耗与电流特性
- 最大耗散功率（Pd）：1W（持续工作的功率上限，需配合串联电阻限流）；
- 反向漏电流（Ir）：10uA@23V（反向截止时漏电极低，减少待机功耗，适配低功耗电路）。
3. 工作范围
- 反向击穿电压：与稳压值一致（30V左右，为工作原理核心）；
- 温度范围：符合工业级标准（-55℃~+150℃，支撑宽温应用）。
三、封装与物理特性
采用SOD-123FL封装（SOD-123改进型），物理特性适配小型化设计：
- 尺寸：约2.0mm×1.2mm×1.0mm（超小型表面贴装，兼容0805及以下PCB封装）；
- 引脚：2引脚无极性（但需反向接入电路：阴极接正、阳极接负）；
- 封装材料：耐高温环氧树脂，耐湿耐温，适配回流焊工艺。
四、典型应用场景
结合参数特性，核心应用场景包括：
- 便携式设备稳压：手持测试仪器、智能穿戴的辅助电源模块，为小功率MCU提供30V基准；
- 工业控制基准源：PLC、传感器模块替代线性稳压器，降低成本与体积；
- 通信设备防护：路由器、交换机电源端口，浪涌时泄放电流保护芯片；
- 汽车电子辅助电路：车载显示屏背光驱动的稳压环节（部分型号具备AEC-Q101汽车级认证）。
五、选型与应用注意事项
使用时需注意3个关键要点：
- 串联电阻计算：公式R=(Vin-Vz)/Iz（Vin为输入电压，Iz取10mA左右），避免功耗超1W；
- 极性确认：必须反向接入（阴极接正、阳极接负），否则无法稳压；
- 焊接工艺：回流焊峰值温度≤260℃，时间≤10秒，避免损伤器件。
KDZVTFTR30B凭借小体积、低漏电流与稳定特性，成为中小功率电路稳压防护的高性价比选择，适配现代电子设计的空间紧凑需求。
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