WMSIC Electronic Components

ROHM RF201LAM4STR

ModelRF201LAM4STR
PackageSOD-128
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM RF201LAM4STR
Type
ROHM
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
RF201LAM4STR
Electronic Component
1
Package
SOD-128
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.054g
Electronic Component
1
Electronic Component
BM0058403347
Current
1.5A
Diode
1
Current(Ir)
1uA@400V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RF201LAM4STR 产品概述

一、产品简介

RF201LAM4STR 是 ROHM(罗姆)推出的一款独立式快恢复/高效率二极管,适用于中高压开关电源和功率整流场合。该器件以 400V 的反向耐压与 1.5A 的整流电流为基础,结合快恢复特性(Trr = 20ns),在提高开关效率的同时兼顾浪涌承受能力与低漏电流,适用于空间受限的表面贴装设计。

二、主要规格

  • 器件型号:RF201LAM4STR(ROHM)
  • 二极管配置:独立式(单只)
  • 正向压降:Vf = 930 mV @ IF = 1.5 A
  • 整流电流:IF(AV) = 1.5 A
  • 非重复峰值浪涌电流:Ifsm = 50 A
  • 直流反向耐压:VR = 400 V
  • 反向电流:IR = 1 μA @ VR = 400 V
  • 反向恢复时间:Trr = 20 ns
  • 工作结温范围:Tj = -55 ℃ ~ +150 ℃
  • 封装:SOD-128,SMD 表面贴装

三、性能亮点

  • 快恢复:20 ns 的反向恢复时间有效减小在高频开关环境下的开关损耗与开关期间产生的电磁干扰(EMI),适合用于高开关频率的电源拓扑。
  • 低正向压降:在 1.5 A 工作点上 Vf ≈ 0.93 V,能在整流与自由轮回路中降低导通损耗,提升整体效率。
  • 高耐压与低漏电:400 V 的耐压配合 1 μA 的低漏电流(在 400 V 测试条件下)使其可用于中高压整流与钳位场合,漏电对系统待机功耗影响小。
  • 良好浪涌能力:50 A 的单次浪涌电流能力,能承受开机浪涌或负载突变造成的瞬态电流。
  • 宽温度范围:-55 ℃ ~ +150 ℃ 的结温范围,适应工业级环境与高温工作状态。

四、典型应用场景

  • 开关电源(SMPS)整流与回收二极管
  • DC–DC 转换器输出整流/自由轮二极管
  • 电池充电器与适配器整流
  • 电机驱动与逆变器辅路:作为钳位或反向保护元件
  • LED 驱动与照明电源(高压侧)
  • 任何需要在中高电压与中等电流下兼顾开关速度与效率的电源设计

五、设计与 PCB 布局建议

  • 热管理:SOD-128 为小型表面贴装封装,连续 1.5 A 工作时应通过增加 PCB 铜箔面积(尤其是焊盘与散热层)来降低结-壳及结-环境温升。尽量在焊盘下方/周围保留足够铜厚以利散热。
  • 最小回路电感:由于为快恢复二极管,建议将二极管与开关器件(MOSFET、变压器)之间的回路尽可能缩短并增大宽度,以降低寄生电感造成的电压尖峰。必要时加入 RC 或 RCD 吸收电路抑制过冲。
  • EMI 与滤波:快恢复特性能降低开关损耗但可能引起高频脉冲,合理布局旁路电容和 EMI 滤波器,有助于抑制辐射与传导干扰。
  • 焊接与回流:遵循 ROHM 提供的回流温度曲线和贴装工艺。若长期曝露于潮湿环境,应参照器件的潮湿敏感度等级(MSL)进行保管与回流前干燥处理(参见正式数据手册)。

六、可靠性与注意事项

  • 在长期高温或高应力工作条件下,请参考 ROHM 的最大额定值与热阻参数,确保结温不超过 150 ℃ 的额定极限。
  • 在高压侧使用时,应考虑系统防护(如浪涌保护、过流保护)以避免超过 Ifsm 或器件瞬时承受能力。
  • 关于封装与储存:SOD-128 为典型表面贴装封装,出厂常采用防潮包装,开封后请按照推荐的回流及干燥流程操作。详细的存储和焊接条件请以 ROHM 官方数据手册为准。

七、封装与采购信息

  • 封装形式:SOD-128(表面贴装)
  • 品牌:ROHM(罗姆)
  • 型号:RF201LAM4STR
    如需批量采购、样片或完整数据手册(包含完整电气特性曲线、热阻、典型应用示意图与回流曲线),建议联系 ROHM 官方或授权代理商获取最新资料与支持。

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