WMSIC Electronic Components

ROHM QH8JC5TCR

ModelQH8JC5TCR
PackageTSMT-8
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM QH8JC5TCR
Type
ROHM
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
QH8JC5TCR
Electronic Component
1
Package
TSMT-8
Electronic Component
2 P
Electronic Component
MOSFET
Electronic Component
1.233g
Electronic Component
1
Electronic Component
BM0252997500
Power Dissipation(Pd)
1.1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
850pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

QH8JC5TCR 产品概述

一、产品简介

QH8JC5TCR 是 ROHM(罗姆)推出的一款双路 P 沟道小信号 MOSFET,面向高电压小功率开关与保护应用。器件额定耐压为 60V(P 沟道常表示为 -60V),封装为 TSMT-8,集成两个 Pch 单元,便于高边开关和双路负载控制。

二、主要参数

  • 数量:2 个 P 沟道
  • 漏源电压 Vdss:60 V(Pch)
  • 连续漏极电流 Id:3.5 A
  • 导通电阻 RDS(on):91 mΩ @ Vgs = 10 V, Id = 3.5 A
  • 功耗 Pd:1.1 W
  • 阈值电压 Vgs(th):2.5 V(典型)
  • 栅极电荷 Qg:17.3 nC @ 10 V
  • 输入电容 Ciss:850 pF @ 30 V
  • 封装:TSMT-8,品牌:ROHM

三、关键特性与优势

  • 低电阻且适合 10 V 驱动:在 Vgs = 10 V 下 RDS(on) 为 91 mΩ,适合需要低导通损耗的高边开关场景。
  • 双通道集成:节省 PCB 面积并简化高边/双路负载控制设计。
  • 中等栅极电荷:Qg = 17.3 nC 表明栅极驱动能量要求适中,需考虑驱动器能力与开关损耗。

四、典型应用

  • 电池供电系统的高边开关与电源路径控制
  • 电源管理、背光或摄像头开关等小信号功率控制
  • 逆极性/过流保护电路、负载切换模块

五、设计与布局建议

  • 驱动电压:推荐 Vgs = -10 V(Pch)以达到标称 RDS(on),注意负向栅极驱动相对于源极的幅值。
  • 热管理:器件 Pd = 1.1 W,TSMT-8 热阻较大,应通过加厚 PCB 铜箔、散热铜箔/过孔来扩展散热面积,避免长时间大电流工作导致过热。
  • 布局:将电源回流、热散路径和栅极驱动路径分开,栅极走线尽量短且并联阻容以抑制振铃。
  • 开关损耗:Qg 与 Ciss 指示在较高开关频率下栅极驱动损耗不可忽视,需估算驱动能量并选择合适驱动器或限流网络。

六、使用注意事项与选型建议

  • 注意器件为 P 沟道,Vgs 的极性与 N 沟道不同,设计时确认驱动逻辑和电位范围。
  • 阈值为 2.5 V,低电压驱动下可能无法完全导通,应保证足够的负向门源电压以降低导通损耗。
  • 若需更大功率或更低 RDS(on),可考虑并联器件,但要做好热均衡与共享电阻设计。
  • 在选型时结合开关频率、导通/开关损耗、散热能力和系统电压等级综合评估。

如需基于 QH8JC5TCR 的典型电路参考、热仿真建议或与其他型号对比,我可以继续提供更详细的设计支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.