WMSIC Electronic Components

ROHM SML-H12U8TT86

ModelSML-H12U8TT86
Package0805
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM SML-H12U8TT86
Type
ROHM
Minimum package
3000 圆盘

Technical parameters

Power
54mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
SML-H12U8TT86
Electronic Component
1
Package
0805
Electronic Component
620nm
Electronic Component
LEDDiode / LED
Electronic Component
0.024g
Electronic Component
1
LED
40mcd
LED
Electronic Component
Electronic Component
BM0227176242
Operating Temperature
40℃~+85℃
Current
20mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SML-H12U8TT86 产品概述

一、产品简介

SML-H12U8TT86 是 ROHM(罗姆)出品的一款高显色橙红色发光二极管,采用0805(2012公制)贴片封装,透镜为无色透明,适用于各种小尺寸状态指示与信号提示场合。峰值波长约620nm,发光颜色为橙红色,视觉表现稳定,可在宽温度范围内工作,便于在消费电子与工业设备中作为指示元件使用。

二、主要规格参数

  • 发光颜色:橙红色
  • 波长(λp):620 nm
  • 正向电压(Vf):2.2 V(If = 20 mA)
  • 正向电流(If):20 mA(常用驱动)
  • 功率:54 mW(额定耗散)
  • 发光强度:40 mcd(If = 20 mA,典型)
  • 二极管配置:共阴极
  • 透镜颜色:无色透明
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:0805(尺寸约2.0 × 1.25 mm)
  • 品牌:ROHM(罗姆)

说明:额定耗散标注为54 mW;按典型 Vf × If 计算(2.2 V × 20 mA)约为44 mW,设计时请参考器件数据手册的最大额定值与温升曲线。

三、性能与特点

  • 小型化封装(0805)适合高密度PCB布局,便于自动贴装与回流焊工艺。
  • 橙红色 620 nm 波长在视觉上饱和度高,指示清晰,适合需要高可见度的环境。
  • 透镜为无色透明,有利于色温一致性与光学耦合,便于与透镜或导光结构配合。
  • 工作温度范围宽 (-40 ~ +85 ℃),可满足多数室内与部分户外环境要求。
  • 共阴极配置利于多色或多灯阵列的电气连接简化(视具体封装与引脚定义而定)。

四、推荐电气连接与实例计算

为保护LED并获得稳定亮度,应在驱动端加入限流电阻或恒流源。举例(基于典型 Vf = 2.2 V,If = 20 mA):

  • 5 V 系统:R = (5.0 − 2.2) / 0.02 = 140 Ω → 可选标准阻值 150 Ω;电阻功耗约 P = (5.0 − 2.2) × 0.02 ≈ 0.056 W。
  • 3.3 V 系统:R = (3.3 − 2.2) / 0.02 = 55 Ω → 可选 56 Ω;电阻功耗约 0.022 W。

建议使用额定功率 ≥ 0.125 W 的电阻以保证可靠性;更优方案为恒流驱动以获得更稳定的亮度与一致性。

五、封装与PCB设计要点

  • 0805 封装尺寸适合常规贴片工艺,焊盘设计应以制造商推荐图纸为准,确保良好焊点与热散逸。
  • 由于器件体积小,铜箔面积与焊盘热容量会影响回流焊温度与焊接质量,建议遵循ROHM回流曲线与焊接指导。
  • 安装时注意极性与共阴极连接方式,避免反向电压损伤。

六、典型应用场景

  • 消费类电子:指示灯、键盘背光、状态指示。
  • 仪器仪表:面板指示、报警信号。
  • 家电与办公设备:电源/工作状态指示。
  • 小型信号与提示装置:由于尺寸小、亮度适中,适合空间受限的场合。

七、可靠性与使用注意

  • 避免超过标称正向电流与功率耗散,长期过驱会缩短寿命或导致颜色漂移。
  • 处理与装配时注意静电防护(ESD),按常规SMD元件防护措施操作。
  • 若用于高温或连续点亮环境,应进行热仿真与实际测温验证,确保结温在允许范围内。

八、采购与合规

ROHM 品牌保证出厂一致性与品质控制,常见于正规分销渠道采购。购买时请确认器件完整的技术资料与封装编码,若需量产或特殊认证(如汽车级),建议向厂家或授权代理咨询对应型号的认证与可用性。

如需进一步的电气特性曲线、焊接资料或推荐封装图纸,可提供具体需求,我可以协助检索和解读原厂数据手册中的关键曲线与建议。

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