Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM EMH60T2R
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM EMH60T2R
- Type
- ROHM
- Minimum package
- 8000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- EMH60T2R
- Electronic Component
- 1
- Package
- SOT-563
- Electronic Component
- 2 NPN
- Electronic Component
- Digital Transistor
- Electronic Component
- 0.011g
- Electronic Component
- 1
- Electronic Component
- BM0000225873
- Operating Temperature
- 55℃~+150℃
- Resistor
- 21
- Resistor
- 2.2kΩ
- Power Dissipation(Pd)
- 150mW
- Electronic Component
- Electronic Component
- Electronic Component
- 8000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EMH60T2R 产品概述
1. 产品简介
EMH60T2R 是一种高性能的数字双极晶体管，包含两个 NPN 预偏压式晶体管，适用于各种电子电路应用。这款产品的额定功率为150mW，具有最大集电极电流（Ic）为100mA，且工作电压可承受的集射极击穿（Vce）最大值为50V。EMH60T2R 的设计目标是满足现代电子设备对高效、紧凑且耐用元件的需求。
2. 主要参数
- 晶体管类型：EMH60T2R 是双 NPN 预偏压式晶体管，适合在低功耗数字电路中使用。
- 集电极电流 (Ic)：该产品最大承受电流为100mA，使其适合于驱动各种负载，包括小型电机和LED等。
- 集射极击穿电压 (Vce)：最大击穿电压为50V，确保在高压环境中稳定运行。
- 基极电阻 (R1)：设置为2.2千欧，帮助控制基极电流以优化性能。
- 发射极电阻 (R2)：为47千欧，支持较大的增益和稳定的工作状态。
3. 电流增益与饱和压降
在特定的工作条件下，EMH60T2R 提供了优异的直流电流增益（hFE），其中在5mA和10V的条件下，最小增益可达到80。这意味着晶体管能够有效放大输入信号，适应各种信号处理应用。此外，Vce 饱和压降的最大值为150mV（在500µA和5mA时），有助于降低功耗并提高效率。
4. 频率响应
此型号具备高达250MHz的跃迁频率，使其非常适用于高频电子应用，包括RF（射频）和微波电路。这项特性确保了在信号传输过程中低的延迟和高效的信号处理能力。
5. 封装和安装
EMH60T2R 采用 SOT-563 和 SOT-666 表面贴装型封装（EMT6），这种紧凑的封装提供了更高的集成度和更小的电路板占用面积，适合现代小型化电子产品需求。表面贴装式设计还简化了制造过程，提高了生产效率与可靠性。
6. 应用领域
凭借其优异的性能参数，EMH60T2R 被广泛应用于多个领域，包括但不限于：
- 消费电子：如手机、平板以及其他便携式设备
- 工业控制：在自动化设备和机器人控制系统中起到关键作用
- 通信设备：用于信号放大与处理的基站及其他通信设备
- 嵌入式系统：适合用于微控制器周边的开关、信号放大和逻辑电路
7. 结论
EMH60T2R 是一款兼具高效能与小型化设计优势的先进数字晶体管，特别适合于需要低功耗、高频及高增益特性的现代电子应用。其优异的电流增益、饱和压降和频率特性，使得该产品在推动电子设备小型化与高效化方面具备重要价值，成为众多电子设计工程师的理想选择。选择 EMH60T2R，将有助于提升产品的整体性能与市场竞争力。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
