WMSIC Electronic Components

ROHM IMD3AT108

ModelIMD3AT108
PackageSOT-457
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM IMD3AT108
Type
ROHM
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
IMD3AT108
Electronic Component
1
Package
SOT-457
Electronic Component
1 NPN, 1 PNP
Electronic Component
Digital Transistor
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0000287908
Operating Temperature
55℃~+150℃
Resistor
1
Resistor
10kΩ
Transistor Type
NPN+PNP
Frequency(f T)
250MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

IMD3AT108 产品概述

IMD3AT108 是一款由知名半导体制造商ROHM(罗姆)出品的高性能数字晶体管,采用表面贴装技术(SMT)封装,封装形式为SC-74 / SOT-457。此款器件设计致力于满足现代电子设备中的多种应用需求,尤其适用于开关电路、信号放大和脉冲电路等场景。其核心特点在于同时集成一个NPN晶体管和一个PNP晶体管,形成一种预偏压式的双晶体管结构,极大地方便了电路设计与集成。

1. 技术参数

IMD3AT108 的设计参数突出其高效能和可靠性。它的集射极击穿电压最大可达50V,确保在各种工作环境下能够稳定运行。其集电极电流(Ic)在最大值时达到100mA,使其能够满足较大负载的需求。此元器件的功率最大可达300mW,具有良好的散热能力和能量效率,适合长期稳定工作。

在电流放大倍数方面,IMD3AT108 的hFE最小值为30,此值是在集电极电流为5mA且供电电压为5V的条件下测得。高增益特性使得该晶体管可以在低输入信号下实现有效的信号放大,适合用于多种低功耗应用。

2. 设计特点

作为一款预偏压式双晶体管,IMD3AT108 具备良好的开关特性。在工作状态下,IC的饱和压降(Vce)最大为300mV,在500µA至10mA的范围内,显示出其极低的导通损耗。这对于需要高效率和低能耗的电路至关重要,尤其适用于便携式和电池供电设备,延长设备的工作时间。

此外,IMD3AT108 具备较高的频率跃迁能力,其频率可达250MHz。这使得该器件适合于高频应用,如射频放大器和高速数字电路等,对信号处理的细致度和rc通频率有着更高的要求。

3. 应用场景

IMD3AT108 的应用场景相当广泛,涵盖了消费电子、工业控制、汽车电子以及通信设备等领域。其双晶体管结构使其在构建电平转换电路(Level Shifting Circuit)、模拟信号处理、驱动小电机及控制继电器和传感器等方面具有极大的灵活性。

在消费电子方面,IMD3AT108 可以用于音频放大器、电视和音响设备中,以实现高品质的声音输出。在工业控制领域,利用其高增益和高开关特性,可有效控制马达和液压阀,为自动化系统提供支撑。

4. 封装与安装

IMD3AT108 采用表面贴装封装(SMT),便于自动化生产和高密度简化电路板设计。SMT封装使得IMD3AT108在物理空间上更为紧凑,且减少了对传统插脚式封装驻留时间的依赖,提升了组装效率、减少了材料成本。同时,SC-74/SOT-457 小尺寸封装也使得该器件能够适应更小型的电子设备设计,满足市场对于小型化电子产品日益增长的需求。

5. 结论

总的来说,IMD3AT108 是一款功能强大且适应范围广泛的数字晶体管。其集成的NPN与PNP结构、优良的电气性能和紧凑的封装设计,使其在现代电子工程应用中表现出色。作为ROHM的优质产品,它为设计师提供了高效、可靠的解决方案,广泛适用于各类电子产品的开发与创新。无论是在实现高效开关控制还是在放大微弱信号,它都能毫无疑问地成为众多电路设计的理想选择。

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