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ROHM LTR18EZPF15R0
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM LTR18EZPF15R0
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 750mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- LTR18EZPF15R0
- Electronic Component
- 1
- Package
- 0612
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.029g
- Electronic Component
- 15Ω
- Electronic Component
- 1
- Electronic Component
- BM0058425041
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTR18EZPF15R0 产品概述
一、产品简介
LTR18EZPF15R0 是 ROHM（罗姆）出品的贴片厚膜电阻，额定功率 750 mW，阻值 15 Ω，精度 ±1%，温度系数 (TCR) ±100 ppm/℃，工作温度范围 -55 ℃ 至 +155 ℃，封装为 0612。该器件以其稳定的电气特性和良好的耐热性能，适合对功率密度与长期可靠性有要求的表面贴装应用。
二、主要特性
- 功率承载：额定功率 750 mW，适合中等功率的信号与电源电路。
- 阻值与精度：15 Ω，±1% 精度，便于在分流、电流检测及电压分压场合实现较高的配对精度。
- 温度性能：TCR ±100 ppm/℃，在宽温区间内保持阻值稳定，工作温度可达 +155 ℃，适应高温环境。
- 结构与工艺：厚膜工艺，具备良好的批量一致性与焊接可靠性；常见卷带包装，便于自动贴装。
三、典型应用
适用于电源管理、分流电阻、电流采样、负载测试、工业控制、通信设备及高温工况下的电子模块。对热量管理和长期漂移有要求的应用尤为合适。
四、安装与热管理建议
- 热管理：在 PCB 布局时预留足够焊盘铜箔以扩散热量，必要时采用散热铺铜或热过孔。
- 额定功率使用：工作温度升高时需按厂商的功率降额曲线进行降额使用，避免超过元件极限。
- 焊接工艺：兼容常规回流焊流程，焊接后避免机械应力集中，遵循 ROHM 焊接和回流建议。
五、可靠性与选型建议
厚膜电阻在抗冲击、耐焊接性方面表现良好，但相较于金属膜器件噪声略高。在需更低噪声或更高精度时，可考虑其他系列；若系统需通过汽车级认证或有特殊可靠性要求，请参照 ROHM 官方 Datasheet 与认证资料。
六、包装与订购提示
常见为卷带（Tape & Reel）适配 SMT 贴装流程。订购时请确认完整料号与包装形式，并参考 ROHM 官方 Datasheet 获取详细电气特性、热降额曲线与封装尺寸图，以确保设计与可靠性符合项目要求。
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