WMSIC Electronic Components

ROHM RRR040P03HZGTL

ModelRRR040P03HZGTL
PackageSC-96
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM RRR040P03HZGTL
Type
ROHM
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
RRR040P03HZGTL
Electronic Component
1
Package
SC-96
Electronic Component
1 P
Electronic Component
MOSFET
Electronic Component
0.068g
Electronic Component
1
Electronic Component
BM0230803327
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RRR040P03HZGTL 产品概述

一、概述

RRR040P03HZGTL 是 ROHM(罗姆)出品的一款 P 沟道功率 MOSFET,针对中低压、高效率开关与负载断开应用优化。器件额定漏源间电压为 30V,连续漏极电流 4A,适合移动设备、电源管理及负载开关等场合的高侧开关或反向保护电路。

二、主要规格

  • 通道类型:P 沟道 MOSFET(数量:1 个)
  • 漏源电压 Vdss:30 V
  • 连续漏极电流 Id:4 A
  • 导通电阻 RDS(on):45 mΩ @ Vgs = −4.5V, Id = 4A
  • 功耗 Pd:1 W(最大耗散功率)
  • 阈值电压 Vgs(th):约 1 V(门极阈值)
  • 栅极电荷 Qg:10.5 nC @ 15 V(用于评估驱动能量)
  • 输入电容 Ciss:1 nF;反向传输电容 Crss:130 pF
  • 工作温度范围:−55 ℃ ~ +150 ℃
  • 封装:SC-96(紧凑型表面贴装,具体引脚与尺寸请参照原厂资料)
  • 品牌:ROHM(罗姆)

三、性能亮点与优势

  • 低导通电阻(45 mΩ)在 4A 工况下能减少导通损耗,提高效率;适合需要低压降的高侧开关。
  • 较小的栅极电荷(10.5 nC)配合 1 nF 的输入电容,使得驱动功率与切换损耗可控,便于在有限的驱动能力下实现快速开关。
  • 宽温度范围与工业级耐受性,适应严苛环境应用。
  • SC-96 封装利于板上节省空间,便于自动化贴装。

四、典型应用场景

  • 电池管理与电源路径切换(高侧开关、反向电流保护)
  • 移动设备与便携电源的负载断开电路
  • DC-DC 转换器输出侧开关、低压控制电路
  • 一般功率开关与保护电路

五、设计与使用建议

  • 作为 P 沟道器件,门极电压相对于源极需为负以导通(例如 Vgs = −4.5V 时标称 RDS(on))。在设计高侧开关时注意源极电位变化对 Vgs 的影响。
  • 由于 Pd = 1 W,热设计需谨慎:在高电流或连续导通场合,建议增大铜箔散热面积或使用散热通孔以避免过热。
  • 串联门极电阻、添加缓冲或驱动器能抑制振铃并控制开关应力;根据 Qg 选择合适的驱动器以平衡开关速度与损耗。
  • 对于电磁兼容(EMC)与浪涌保护,建议在输入或输出侧配合 TVS 或钳位电路保护器件免受瞬态过压冲击。

六、封装与可靠性注意

  • SC-96 为小型 SMD 封装,具体焊盘、尺寸与热阻请参照 ROHM 官方规格书,设计 PCB 时预留足够散热铜箔和焊盘。
  • 器件为静电敏感元件(ESD),在搬运和贴装过程中应采取防静电措施;储存与回流焊条件遵循厂家推荐。

七、小结

RRR040P03HZGTL 以其 30V/4A 的电气规格、低 RDS(on) 与较低栅极电荷,适合用于对效率与空间有要求的高侧开关与保护应用。设计时需重视热管理与门极驱动电平,参照 ROHM 数据手册以获得完整电气特性和封装信息,从而确保电路稳定可靠。

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