Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM UCR10EVHFSR011
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM UCR10EVHFSR011
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 330mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- UCR10EVHFSR011
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- Current Sense Resistor / Shunt
- Electronic Component
- ±1%
- Electronic Component
- 0.027g
- Electronic Component
- 11mΩ
- Electronic Component
- 1
- Electronic Component
- BM0230593217
- Electronic Component
- SMD
- Resistor Type
- Shunt
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
UCR10EVHFSR011 产品概述
一、产品概述
UCR10EVHFSR011 是 ROHM（罗姆）推出的一款贴片分流电阻（电流采样电阻），标称阻值 11 mΩ，精度 ±1%，额定功率 330 mW，封装为常用的 0805（约 2.0 × 1.25 mm）。该器件专为精确电流检测设计，低阻值带来较小电压降，适合嵌入式电源、锂电池管理、DC–DC 变换器和电机驱动等需要实时电流监测的场景。
二、主要特性
- 阻值：11 mΩ，低阻抗，减少功率损耗与热量生成。
- 精度：±1%，利于提高电流测量和控制算法的精度。
- 额定功率：330 mW（在额定环境下），需考虑温升与散热条件。
- 封装：0805 SMD，适合自动贴装及紧凑 PCB 布局。
- 品牌与型号：ROHM UCR10EVHFSR011，具有可靠的制造与一致性。
三、关键电气指标与计算示例
- 典型最大连续电流（理论值）：Imax = sqrt(P/R) ≈ sqrt(0.33/0.011) ≈ 5.47 A（实际使用时受温度和 PCB 散热限制，应适当降额）。
- 在 1 A 时耗散功率约 11 mW；在 5 A 时耗散约 275 mW，压降约 55 mV；在接近额定功率时压降约 60 mV。
这些数值有助于选择采样放大器并评估系统能耗与发热。
四、典型应用
- 电池管理系统（BMS）电流采样
- 开关电源与 DC–DC 电流检测
- 充电器与电源适配器的过流保护与计量
- 电机驱动和负载监控
- 工业控制与消费类电子的电流监测
五、封装与布局建议
- 0805 小封装便于高密度 PCB 布局，但散热面积有限；若长期大电流工作，应在 PCB 上提供较宽的铜箔热散路径并考虑多层铜铺设。
- 为提高测量精度，建议尽量缩短电流走线并采用对称布线；若需要更高精度，宜在测量端采用四线（Kelvin）采样或在附近布置差分放大器。
- 安装时遵循常规回流焊工艺，避免多次高温重流对电阻稳定性不利。
六、选型与使用注意事项
- 确认实际工作电流与散热条件，必要时按工作温度降额选型。
- 考虑系统允许的压降：11 mΩ 在大电流下仍会产生数十 mV 的压降，应与系统电源精度要求匹配。
- 若关注温度系数（TCR）与长时间漂移，应参考厂商完整数据手册并做可靠性评估。
- 与电流检测放大器配合时，注意输入共模电压范围（高侧/低侧测量差异）及滤波设计，避免采样信号被噪声污染。
总结：UCR10EVHFSR011 以其低阻值、高精度和标准 0805 封装，适用于空间受限且需精确电流测量的应用场合。合理的 PCB 散热设计与匹配的测量电路，可发挥其在电流采样与能耗控制中的优势。若需更详细的温度特性与可靠性数据，请参考 ROHM 官方数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
