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ROHM LTR18EZPF75R0
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ROHM LTR18EZPF75R0
- Type
- ROHM
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 750mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- LTR18EZPF75R0
- Electronic Component
- 1
- Package
- 0612
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.029g
- Electronic Component
- 75Ω
- Electronic Component
- 1
- Electronic Component
- BM0259703684
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTR18EZPF75R0 产品概述
一、产品简介
LTR18EZPF75R0 为 ROHM（罗姆）推出的厚膜贴片电阻，封装为 0612（公制 1632，约 1.6 mm × 3.2 mm）。该元件阻值 75 Ω，额定功率 750 mW，精度 ±1%，温度系数 ±100 ppm/℃，工作温度范围 -55 ℃ 至 +155 ℃。适用于对体积、可靠性与中等功耗要求的表面贴装电路（SMT）环境。
二、主要参数
- 阻值：75 Ω
- 精度：±1%
- 额定功率：750 mW（环境和PCB布局影响实际耗散能力）
- 温度系数（TCR）：±100 ppm/℃
- 工作温度：-55 ℃ ~ +155 ℃
- 结构：厚膜电阻，贴片型，0612（1632）封装
- 品牌：ROHM（罗姆）
三、产品特性与优势
- 稳定性：厚膜工艺在常规应用下具有良好的长期稳定性和抗机械应力能力。
- 中等功耗能力：750 mW 的额定功率适合阻尼、电阻分压、信号终端等中等功耗场合。
- 紧凑封装：0612 封装在占板面积和散热性能之间取得折中，适合空间受限的 SMT 布局。
- 精度与温漂平衡：±1% 精度配合 ±100 ppm/℃ 的温漂，适用于需一定精度和温度稳定性的应用。
四、典型应用场景
- 信号匹配与终端阻抗（例如视频/通信链路的 75 Ω 终端）
- 电阻分压器与偏置网络
- 测试/测量电路的标准阻值配置
- 通用电子设备中的阻尼与限流元件
五、使用与布局建议
- 功率降额：实际可耗散功率受 PCB 铜箔面积、厚度及周围元器件影响。在高环境温度或散热不良的情况下应按厂商资料及系统散热条件适当降额。
- 布局：扩大焊盘铜箔面积并采用热 vias 可改善散热；两端焊盘对称布局有利于热均衡与机械应力分散。
- 焊接：遵循 ROHM 或通用无铅回流焊工艺规范，避免超温或长时间高温暴露导致阻值漂移。
- 测试：在关键精度应用中，建议在最终焊接后进行电阻测量以确认阻值和漂移符合要求。
六、可靠性与检验
厚膜贴片电阻需通过典型的环境与循环测试（高温、高湿、机械冲击、温度循环等）以验证可靠性。出于设计保守考虑，应在产品开发早期进行样机长期老化与温度循环试验，确认在目标应用环境下的稳定性与寿命。
七、选型建议与替代方案
- 如需更低温漂或更高精度，建议考虑薄膜或金属膜电阻器件。
- 如需更高功率或更好散热性能，可选用更大封装（如 1210、2010 等）或功率型电阻。
- 对于工业汽车级应用，选型时应参考厂家完整数据手册以确认是否满足振动、温度循环和电气规范。
八、订购与标识
常见订购信息包含型号（LTR18EZPF75R0）、阻值与精度、卷带包装或切带形式等。订购前建议参阅 ROHM 官方数据手册以获取完整的电气图表、封装尺寸、推荐焊盘与可靠性试验数据。
如需进一步的 PCB 热仿真建议、功率降额曲线或替代型号比对，可提供具体电路板布局与应用环境，我可协助给出更精确的工程建议。
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