WMSIC Electronic Components

ROHM LTR18EZPF13R0

ModelLTR18EZPF13R0
Package0612
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM LTR18EZPF13R0
Type
ROHM
Minimum package
5000 圆盘

Technical parameters

Power
750mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
LTR18EZPF13R0
Electronic Component
1
Package
0612
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.029g
Electronic Component
13Ω
Electronic Component
1
Electronic Component
BM0263492713
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ROHM LTR18EZPF13R0 厚膜贴片电阻产品概述

一、产品基本定位

LTR18EZPF13R0是ROHM(罗姆)推出的0612封装厚膜贴片电阻,针对中功率电路场景设计,兼顾精度、功率密度与宽温稳定性,适用于工业、通信及部分汽车电子领域的常规功率负载需求。该型号以小封装实现750mW额定功率,是紧凑电路布局中平衡性能与体积的优选方案。

二、核心性能参数解析

  1. 阻值与精度:标称阻值13Ω,精度等级±1%,满足大多数需要中等精度的电路设计(如反馈回路、分压网络),避免因阻值偏差导致的电路性能波动;
  2. 功率能力:25℃环境下额定功率750mW,在0612小封装(约1.6mm×0.8mm)下实现较高功率密度,适配高密度PCB布局;
  3. 温度特性:温度系数(TCR)为±100ppm/℃,即温度每变化1℃,阻值变化不超过0.013Ω(13Ω×100ppm),稳定性优于普通厚膜电阻;
  4. 工作温度范围:-55℃至+155℃,覆盖工业级与汽车级部分应用的温度需求,适应极端环境(如高温车间、户外通信设备);
  5. 封装规格:0612英制贴片封装,符合IPC标准,支持标准SMT贴装工艺,与其他同封装元器件兼容性强。

三、关键技术特性

  1. 厚膜工艺优势:采用ROHM成熟厚膜印刷技术,电阻膜层均匀性好,长期使用阻值漂移小(经1000小时高温存储测试,漂移率≤0.5%);
  2. 功率降额特性:具备合理高温降额曲线(如125℃时额定功率降额至约500mW),确保不同温度下的稳定工作,避免过功率损坏;
  3. 抗环境干扰:电阻表面涂覆耐湿、抗硫化涂层,可抵御工业环境中的湿度、硫化气体影响,延长使用寿命(抗硫化测试符合AEC-Q200相关要求);
  4. 低噪声特性:厚膜电阻本身噪声水平较低(典型值<1nV/√Hz),适合信号电路中的功率负载设计,避免噪声干扰。

四、典型应用场景

  1. 工业控制电路:PLC(可编程逻辑控制器)的I/O接口、传感器信号调理电路中的分压/负载电阻;
  2. 电源模块:DC-DC转换器的反馈电阻、线性电源的限流电阻,满足中功率输出的稳定需求;
  3. 通信设备:基站射频电路的匹配电阻、路由器/交换机的电源滤波电阻;
  4. 汽车电子(部分场景):车载信息娱乐系统的电源电路、传感器信号处理电路(基础参数覆盖宽温,需确认具体车型认证);
  5. 消费电子:LED驱动电路的限流电阻、音频设备的负载电阻,兼顾功率与体积。

五、封装与可靠性说明

  1. 封装兼容性:0612封装符合IPC-7351标准,可与其他0612封装元器件兼容贴装,无需特殊工艺调整;
  2. 焊接可靠性:采用耐高温焊端设计(可承受260℃回流焊温度),支持回流焊、波峰焊等标准焊接工艺,焊接后无虚焊、脱落风险;
  3. 长期可靠性:经ROHM可靠性测试(高温存储、温度循环、湿度老化),满足工业级1000小时以上的长期稳定工作要求,失效率(FIT)≤100。

六、选型与应用注意事项

  1. 功率降额:实际应用中需根据工作温度、环境条件进行功率降额(参考ROHM官方降额曲线),建议工作功率不超过额定功率的80%(高温场景需进一步降低);
  2. 精度匹配:若电路对阻值精度要求更高(如±0.1%),需选择精密厚膜或金属膜电阻,但本型号±1%已覆盖多数常规场景;
  3. 布局建议:贴装时需预留足够散热空间(与相邻发热元件间距≥1mm),避免因局部过热导致功率降额不足。

该型号凭借ROHM的工艺优势与宽温特性,成为中功率电路设计中平衡性能、体积与成本的实用方案,适用于对稳定性有一定要求的工业及通信领域。

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