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ROHM LTR18EZPJ3R9
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- ROHM LTR18EZPJ3R9
- Type
- ROHM
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 750mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- LTR18EZPJ3R9
- Electronic Component
- 1
- Package
- 0612
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.028g
- Electronic Component
- 3.9Ω
- Electronic Component
- 1
- Electronic Component
- BM0230029967
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTR18EZPJ3R9 产品概述
一、产品简介
LTR18EZPJ3R9 为 ROHM（罗姆）出品的贴片厚膜电阻，阻值 3.9Ω，额定功率 750mW，精度 ±5%。封装标识为 0612，适用于对功率和耐温有中等要求的通用电路。厚膜工艺成本效益高、满足大批量生产需求，是电源、信号及分流应用中的常见选择。
二、主要参数与电气性能
- 阻值：3.9Ω，阻值容差 ±5%（常见容差等级，便于库存与成本控制）。
- 额定功率：750mW（在规定的环境温度与散热条件下）。
- 温度系数（TCR）：±200 ppm/℃，属厚膜电阻的典型水平，温漂相对金属膜会略大，需在温度敏感电路中评估影响。
- 工作温度范围：-55℃ ～ +155℃，适应工业级温度环境。
- 封装：0612（适配常规贴片组装与回流焊工艺，利于自动化贴装）。
示例电气计算（参考）：在额定功耗 0.75W 下，允许通过的直流电流大约为 I = sqrt(P/R) ≈ 0.44A，对应电压降约 V = I·R ≈ 1.7V。实际允许电流需考虑 PCB 散热、环境温度与功率降额。
三、应用建议与选型考量
- 若用于电流检测/分流，应注意功耗与电压降：3.9Ω 在较大电流下会产生明显能耗与热量，适合低电流分流或限流用途。
- 对温漂敏感的测量电路，建议采用更低 TCR 的金属膜或厚膜并配合温度补偿设计。
- 在高工作温度或受限散热条件下，需按 ROHM 的功率温度特性进行降额（出厂规格书为最终依据）。
四、可靠性与环境特性
厚膜电阻结构稳健，抗冲击与耐振动性能良好，符合工业级工作温度；长期可靠性依赖于焊接质量与 PCB 散热设计。适用于要求宽温域、一般环境防护（若在高湿或腐蚀性气氛中使用，建议采取额外封装或保护措施）。
五、封装与焊接注意事项
- 支持常规回流焊工艺，建议参照 ROHM 提供的回流曲线进行温度控制，避免过高峰值温度或过长热暴露。
- 推荐合理设计焊盘与铜箔面积以优化热传导和散热；焊盘过大或过小均可能影响阻值稳定性与散热。
- 存储与贴装时注意防潮处理，避免长期暴露在潮湿环境导致焊接问题。
六、典型应用场景
- 电源滤波与限流元件、参考电阻或电路偏置网络；
- 通信设备、消费电子、仪表仪器的通用电阻需求；
- 需要中等功率承载且追求成本效益的批量生产产品。
总结：LTR18EZPJ3R9 以其 3.9Ω/750mW 的规格在成本与性能之间取得平衡，适合工业与消费类的通用电阻应用。在最终设计中，请参照ROHM完整规格书与功率-温度降额曲线，结合 PCB 散热设计以确保长期稳定性与安全裕度。
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