WMSIC Electronic Components

ROHM LTR18EZPJ180

ModelLTR18EZPJ180
Package0612
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM LTR18EZPJ180
Type
ROHM
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
750mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
LTR18EZPJ180
Electronic Component
1
Package
0612
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.028g
Electronic Component
18Ω
Electronic Component
1
Electronic Component
BM0058427287
Operating Temperature
55℃~+155℃
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LTR18EZPJ180 产品概述

一、产品概要

LTR18EZPJ180 为 ROHM(罗姆)推出的一款厚膜贴片电阻,阻值 18Ω(18R),精度 ±5%(J),额定功率 750mW,适用于需中等功率与成本优化的表面贴装电路。封装标识为 0612(SMD 型号),适合自动贴装与回流焊工艺。

二、电气性能要点

  • 电阻类型:厚膜(Thick film)
  • 阻值:18Ω(标称)
  • 精度:±5%(J)
  • 额定功率:750mW(环境与散热条件下)
  • 温度系数(TCR):±200 ppm/℃,适合对温漂要求不严的普通电子应用
  • 工作温度范围:-55℃ ~ +155℃

三、物理与环境特性

0612 封装为贴片形式,适用于空间受限但需较高功耗承载的设计。厚膜电阻结构在成本、可获得阻值范围与批量一致性方面具有优势,但相较薄膜或合金电阻,温漂和噪声略高。器件符合一般工业级温度与湿热环境要求,具体环境应以厂商 Datasheet 为准。

四、典型应用场景

适用于电源分流、限流、去耦电路、驱动/驱动前级、消费电子与工业控制等场合。因额定功率达 750mW,可用于中等功率的功率耗散位置,但不建议用于脉冲能量过大或严格温漂控制的精密测量电路。

五、选型与设计注意事项

  • 功率降额:额定 750mW 需在指定环境温度与 PCB 散热条件下使用,超过环境温度时须按厂商的功率-温度降额曲线线性降额。
  • 散热设计:通过增大焊盘铜箔面积、采用多层铜层或散热孔(via)提升热传导,降低结温。
  • 温漂与精度:±200 ppm/℃ 与 ±5% 精度适合一般应用;对精密采样/测量请选用低 TCR 与更高精度型号。
  • 瞬态与过载:避免长时间超过额定功率或承受大电流脉冲,必要时增加保护元件(如保险、限流)或选用更高功率件。

六、焊接与组装建议

适用于常规回流焊工艺。为保证可靠焊接,推荐参考 ROHM 的焊接温度曲线与推荐焊盘尺寸,控制回流曲线峰值温度与时间,避免因过热或冷却过快引致机械应力或电阻漂移。

七、可靠性与规范

ROHM 品牌产品通常满足 RoHS 要求并通过相关可靠性测试(高温储存、温度循环、湿热等),具体认证信息请参阅官方 Datasheet 与合格证书。长期可靠性依赖于合理的热管理与规范的 PCB 设计。

八、总结

LTR18EZPJ180 是一款面向通用电子与工业应用的厚膜 SMD 电阻,兼顾成本与中等功率能力。选型时关注功率降额与散热设计、评估温漂对系统精度的影响,按 ROHM 提供的资料与推荐工艺执行可获得稳定的长期性能。如需更详细的尺寸、焊盘建议和功率-温度曲线,请参考 ROHM 官方 Datasheet。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.