Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTR18EZPJ180 为 ROHM(罗姆)推出的一款厚膜贴片电阻,阻值 18Ω(18R),精度 ±5%(J),额定功率 750mW,适用于需中等功率与成本优化的表面贴装电路。封装标识为 0612(SMD 型号),适合自动贴装与回流焊工艺。
0612 封装为贴片形式,适用于空间受限但需较高功耗承载的设计。厚膜电阻结构在成本、可获得阻值范围与批量一致性方面具有优势,但相较薄膜或合金电阻,温漂和噪声略高。器件符合一般工业级温度与湿热环境要求,具体环境应以厂商 Datasheet 为准。
适用于电源分流、限流、去耦电路、驱动/驱动前级、消费电子与工业控制等场合。因额定功率达 750mW,可用于中等功率的功率耗散位置,但不建议用于脉冲能量过大或严格温漂控制的精密测量电路。
适用于常规回流焊工艺。为保证可靠焊接,推荐参考 ROHM 的焊接温度曲线与推荐焊盘尺寸,控制回流曲线峰值温度与时间,避免因过热或冷却过快引致机械应力或电阻漂移。
ROHM 品牌产品通常满足 RoHS 要求并通过相关可靠性测试(高温储存、温度循环、湿热等),具体认证信息请参阅官方 Datasheet 与合格证书。长期可靠性依赖于合理的热管理与规范的 PCB 设计。
LTR18EZPJ180 是一款面向通用电子与工业应用的厚膜 SMD 电阻,兼顾成本与中等功率能力。选型时关注功率降额与散热设计、评估温漂对系统精度的影响,按 ROHM 提供的资料与推荐工艺执行可获得稳定的长期性能。如需更详细的尺寸、焊盘建议和功率-温度曲线,请参考 ROHM 官方 Datasheet。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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