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ROHM LTR18EZPF56R0
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM LTR18EZPF56R0
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 750mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- LTR18EZPF56R0
- Electronic Component
- 1
- Package
- 0612
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.029g
- Electronic Component
- 56Ω
- Electronic Component
- 1
- Electronic Component
- BM0058407433
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTR18EZPF56R0 产品概述
一、产品简介
LTR18EZPF56R0 为 ROHM（罗姆）出品的贴片厚膜电阻，封装为 0612（公制 1632，尺寸约 1.6 mm × 3.2 mm），标称阻值 56Ω，阻值精度 ±1%，额定功率 750 mW。该系列针对空间受限但需要较高功率与可靠性的表贴应用设计，兼顾体积与耐热性能，适用于各种消费电子与工业设备中的电阻网络与限流场合。
二、主要技术参数
- 阻值：56Ω
- 精度：±1%（1/100）
- 额定功率：750 mW
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0612（1632 公制）表面贴装（SMD）
- 工艺类型：厚膜电阻
三、性能特点
- 高可靠性：厚膜工艺结合 ROHM 的制造与质量控制，提供稳定的电阻特性与长寿命表现。
- 精度与温漂平衡：±1% 阻值精度满足多数精密分压、偏置与电流检测需求；±100 ppm/℃ 的 TCR 在中等精度场合表现良好。
- 紧凑的功率密度：在 0612 小封装中实现 750 mW 额定功率，适合对功耗与空间双重要求的应用。
- 宽工作温度：-55℃ 至 +155℃，适应工业级温度环境。
四、可靠性与环境适应性
该型号适配常见工业与商业环境下的温度与湿度循环考核，厚膜材料对热循环与机械应力具有较好耐受性。实际设计时建议参考 ROHM 数据手册中的温度降额曲线与可靠性测试（如焊接热循环、耐潮湿试验等）以确保在极端条件下仍满足寿命要求。
五、典型应用场景
- 电源与电池管理中的限流、分压与阻尼电路
- 模拟前端的阻抗匹配与偏置电阻
- LED 驱动、显示与背光电路中的电流控制
- 通信设备与工业控制器中对空间与功耗有均衡需求的电阻元件
六、PCB 设计与焊接建议
- 焊接：支持常规回流焊（含无铅回流），请遵循 ROHM 的回流曲线与焊接工艺规范，避免过度加热导致元件应力或阻值漂移。
- 散热：尽量增大焊盘与周边铜箔面积以提高散热能力；在多功率元件密集区域设计散热通路，必要时采用热迹或过孔辅助散热。
- 封装与布局：0612 尺寸需对应标准封装尺寸的焊盘布局，保持与其他元器件足够间距以降低热耦合影响。
- 清洁与处理：普通清洗工艺可用，避免使用对厚膜涂层有损害的腐蚀性清洗剂。存储与贴装过程中避免异常机械应力。
七、选型与采购注意事项
在选型时，应考虑实际工作温度下的功率降额、安全裕度与长期漂移需求；对精度或温漂要求更高的场合，可比对薄膜或低 TCR 型号。采购时请确认完整料号、封装与包装方式（卷带/盘装），并参考 ROHM 官方数据手册以获取详细电气曲线与可靠性数据。如需替代或评估并联/串联方案以满足功率或阻值特殊需求，也可咨询供应商获取支持。
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