Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
ROHM LTR18EZPF62R0
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM LTR18EZPF62R0
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 1.5W
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- LTR18EZPF62R0
- Electronic Component
- 1
- Package
- 0612
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.028g
- Electronic Component
- 62Ω
- Electronic Component
- 1
- Electronic Component
- BM0259703683
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTR18EZPF62R0 产品概述
一、产品简介
LTR18EZPF62R0 为 ROHM（罗姆）推出的厚膜贴片电阻，阻值 62Ω，精度 ±1%，额定功率 1.5W，温度系数（TCR）±100ppm/℃，工作温度范围 -55℃ 至 +155℃，符合汽车级 AEC-Q200 可靠性规范。0612 封装、宽端子设计，适用于需要高功率密度与良好机械强度的表面贴装场合，包装形式为卷带（T/R）。
二、主要特性
- 厚膜制造工艺，成本效益高、批次一致性好；
- 精度 ±1%，适用于一般精密限流、分压和补偿电路；
- 额定功率 1.5W，适合中等功率耗散场景；
- TCR ±100ppm/℃，温漂稳定，适应温度变化的电路要求；
- 宽端子设计，提高焊接可靠性与热散能力；
- AEC-Q200 汽车级认证，满足车载电子对可靠性的严格要求。
三、电气与环境参数
- 阻值：62Ω ±1%；
- 额定功率：1.5W（具体热阻与功率降额请参照厂方数据手册）；
- 温度系数：±100ppm/℃；
- 工作温度：-55℃ ~ +155℃；
- 包装：T/R 卷带，便于自动化贴装。
四、封装与机械特性
- 0612 尺寸封装（具体外形与引脚尺寸请参考 ROHM 数据手册）；
- 宽端子（Wide Terminal）有利于形成更大焊点，减小引脚机械应力与冷热循环时的断裂风险；
- 厚膜电阻通常具有良好的抗冲击与抗振动能力，适合恶劣工况。
五、典型应用场景
- 汽车电子：车身控制模块、车灯驱动、传感器接口；
- 功率分流和限流：电源管理、驱动电路；
- 工业控制：变频器、驱动器、检测放大模块；
- 消费类电子要求较高耐热与可靠性的应用。
六、选型与电路设计建议
- 功率降额：在高环境温度或受限散热条件下需按厂方功率降额曲线选型，保证长期可靠；
- 板级散热：在 PCB 设计中增加铜箔面积、铺铜或采用热沉/过孔传播热量，有助于提升允许功率；
- 焊盘设计：采用与宽端子匹配的焊盘，保证良好焊接质量并降低机械应力；
- 并联/串联：当单元功率或阻值无法满足时，可采用并联或串联组合，但需考虑均流与容差影响。
七、可靠性与质量保证
- 产品通过 AEC-Q200 认证，经过高低温循环、湿热、机械冲击等汽车级可靠性试验；
- 厚膜结构在长期稳定性上表现良好，但对高能脉冲或瞬态过电压需加保护措施（如限流、吸收器件）。
八、存储与焊接注意事项
- 遵循 ROHM 推荐的回流焊温度曲线，避免重复高温循环影响可靠性；
- 储存时防潮、防尘，卷带开封后尽快贴装使用；
- 焊接与后处理过程中避免对器件施加过大机械应力。
总结：LTR18EZPF62R0 以其 1.5W 功率、窄温漂和汽车级可靠性，适合要求耐热、耐振且需中等功率耗散的工业与车载应用。具体热性能、封装尺寸和功率降额曲线请参照 ROHM 官方数据手册，以确保设计与可靠性满足目标系统要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
